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- Thermal Resistance @ Natural：
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- Material Finish：
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Discover 12 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
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Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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Top Mount | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
9,699
|
3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
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Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
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Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK SMT D-PAK/TO-252 TIN
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Top Mount | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
9,436
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 .4" BLK
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Top Mount | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.5W @ 30°C | 15.00°C/W @ 400 LFM | 56.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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TO-5 PUSH-ON HEATSINK
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Board Level | Aluminum | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | Press Fit | TO-5 | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Cylindrical | - | - | 0.317" (8.05mm) ID, 0.375" (9.52mm) OD | Press Fit | TO-5 | 1.0W @ 70°C | 45.00°C/W @ 200 LFM | 90.00°C/W | Hard Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | Rectangular, Fins | 1.750" (44.45mm) | 1.760" (44.70mm) | - | Bolt On and PC Pin | TO-220, TO-218 | 6.0W @ 60°C | 6.00°C/W @ 400 LFM | 8.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level | Aluminum | Cylindrical | - | - | 0.315" (8.00mm) ID, 1.250" (31.75mm) OD | Press Fit | TO-5 | 1.8W @ 50°C | 14.00°C/W @ 200 LFM | 21.00°C/W | Black Anodized |
