- Manufacturer:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Natural:
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Discover 3 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | ||
Wakefield-Vette |
3,636
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ H=.45" BLK
|
625 | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | ||||
CTS Thermal Management Products |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.01"SQ
|
BDN | 1.010" (25.65mm) | 1.010" (25.65mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | 26.40°C/W | ||||
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | 0.984" (25.00mm) | 0.984" (25.00mm) | Adhesive | BGA | 0.450" (11.43mm) | - |