Discover 13 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Material Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural Material Finish
274-1AB
Wakefield-Vette
11,297
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 LOW HEIGHT BLK
274 Board Level Aluminum Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - Bolt On TO-220 0.375" (9.52mm) 2.0W @ 56°C 28.00°C/W Black Anodized
574502B00000G
Aavid, Thermal Division of Boyd Corporation
29,991
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 VERT MNT .75"
- Board Level Aluminum Rectangular, Fins 0.750" (19.05mm) 0.860" (21.84mm) - Clip TO-220 0.395" (10.03mm) 3.0W @ 60°C 21.20°C/W Black Anodized
577102B04000G
Aavid, Thermal Division of Boyd Corporation
3,384
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 W/TAB .375"
- Board Level, Vertical Aluminum Rectangular, Fins 0.750" (19.05mm) 0.520" (13.21mm) - Bolt On and PC Pin TO-220 0.375" (9.52mm) 1.0W @ 30°C 25.90°C/W Black Anodized
574502B03700G
Aavid, Thermal Division of Boyd Corporation
10,420
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO220 VER MNT W/TAB.75"
- Board Level, Vertical Aluminum Rectangular, Fins 0.750" (19.05mm) 0.810" (20.57mm) - Clip and PC Pin TO-220 0.390" (9.91mm) 3.0W @ 60°C 21.20°C/W Black Anodized
625-45AB
Wakefield-Vette
3,636
3 days
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MOQ: 1  MPQ: 1
HEATSINK CPU 25MM SQ H=.45" BLK
625 Top Mount Aluminum Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - Thermal Tape, Adhesive (Not Included) BGA 0.450" (11.43mm) - - Black Anodized
7142DG
Aavid, Thermal Division of Boyd Corporation
976
3 days
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MOQ: 1  MPQ: 1
HEATSINK TO-220 TIN CLIP-ON 21MM
- Board Level Copper Rectangular, Fins 0.780" (19.81mm) 0.520" (13.21mm) - Clip and Board Locks TO-220 0.515" (13.08mm) 1.0W @ 30°C 20.30°C/W Tin
BDN10-3CB/A01
CTS Thermal Management Products
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK CPU W/ADHESIVE 1.01"SQ
BDN Top Mount Aluminum Square, Pin Fins 1.010" (25.65mm) 1.010" (25.65mm) - Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.355" (9.02mm) - 26.40°C/W Black Anodized
231-69PAB-15V
Wakefield-Vette
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK
231 Board Level, Vertical Aluminum Rectangular, Fins 0.690" (17.53mm) 0.835" (21.21mm) - Bolt On and PC Pin TO-220 0.400" (10.16mm) 2.0W @ 45°C - Pre-Black Anodized
231-69PABE-15V
Wakefield-Vette
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK TO-220 VERT BLK
231 Board Level, Vertical Aluminum Rectangular, Fins 0.690" (17.53mm) 0.835" (21.21mm) - Bolt On and Board Mounts TO-220 0.400" (10.16mm) 2.0W @ 45°C - Black Anodized
642-35ABT3
Wakefield-Vette
Inquiry
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MOQ: 1  MPQ: 1
HEAT SINK WITH THERMAL TAPE
642 Top Mount Aluminum Square, Fins 1.378" (35.00mm) 1.378" (35.00mm) - Thermal Tape, Adhesive (Included) BGA 0.350" (8.89mm) - - Black Anodized
625-45ABT3
Wakefield-Vette
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK CPU 25MM SQ W/DBL TAPE
625 Top Mount Aluminum Square, Pin Fins 0.984" (25.00mm) 0.984" (25.00mm) - Adhesive BGA 0.450" (11.43mm) - - Black Anodized
2292BG
Aavid, Thermal Division of Boyd Corporation
Inquiry
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MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Board Level Aluminum Cylindrical - - 0.300" (7.62mm) ID, 1.125" (28.57mm) OD Thermal Tape, Adhesive (Not Included) BGA - 1.5W @ 40°C - Black Anodized
833702T00000
Comair Rotron
Inquiry
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MOQ: 1  MPQ: 1
HEATSINK STAMP 9.5X22X28MM
- Board Level, Vertical Copper Rectangular, Fins 1.100" (27.94mm) 0.866" (22.00mm) - Clip and PC Pin TO-220 0.375" (9.52mm) 1.5W @ 40°C - Tin