- Manufacturer:
-
- Package Cooled:
-
- Height Off Base (Height of Fin):
-
- Thermal Resistance @ Natural:
-
Discover 2 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | ||
CTS Thermal Management Products |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.01"SQ
|
BDN | Square, Pin Fins | 1.010" (25.65mm) | 1.010" (25.65mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | 26.40°C/W | ||||
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK WITH THERMAL TAPE
|
642 | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | BGA | 0.350" (8.89mm) | - |