- Type：
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- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Shape | Length | Width | Diameter | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | |
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Wakefield-Vette |
3,636
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ H=.45" BLK
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625 | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Not Included) | 0.450" (11.43mm) | - | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK WITH THERMAL TAPE
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642 | Top Mount | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | - | Thermal Tape, Adhesive (Included) | 0.350" (8.89mm) | - | ||
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Wakefield-Vette |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Top Mount | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Adhesive | 0.450" (11.43mm) | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Board Level | Cylindrical | - | - | 0.300" (7.62mm) ID, 1.125" (28.57mm) OD | Thermal Tape, Adhesive (Not Included) | - | 1.5W @ 40°C |
