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- Attachment Method：
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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
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Wakefield-Vette |
3,636
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ H=.45" BLK
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625 | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | - | ||
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CTS Thermal Management Products |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.01"SQ
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BDN | Square, Pin Fins | 1.010" (25.65mm) | 1.010" (25.65mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | 26.40°C/W | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEAT SINK WITH THERMAL TAPE
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642 | Square, Fins | 1.378" (35.00mm) | 1.378" (35.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | ||
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Wakefield-Vette |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Adhesive | BGA | 0.450" (11.43mm) | - |
