Discover 7 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Material Finish
655-53AB
Wakefield-Vette
2,632
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 40.6MM SQ H=.525"
655 Top Mount Square, Pin Fins 1.600" (40.64mm) 1.600" (40.64mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.522" (13.27mm) 4.0W @ 40°C Black Anodized
628-65AB
Wakefield-Vette
4,378
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.65"
628 Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Not Included) Assorted (BGA, LGA, CPU, ASIC...) 0.650" (16.51mm) 3.0W @ 20°C Black Anodized
MA-102-55E
Ohmite
137
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FOR TO-247 TO-264 BLK
M Top Mount Rectangular, Fins 2.170" (55.12mm) 1.350" (34.30mm) Clip and PC Pin TO-247, TO-264 1.520" (38.61mm) 16.0W @ 43°C Black Anodized
MV-102-55E
Ohmite
159
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FOR TO-247 TO-264
M Top Mount Rectangular, Fins 2.170" (55.12mm) 1.350" (34.30mm) Clip and PC Pin TO-247, TO-264 1.520" (38.61mm) 16.0W @ 43°C Degreased
663652F00000G
Aavid, Thermal Division of Boyd Corporation
7
3 days
-
MOQ: 1  MPQ: 1
66365 EXTRUSION 0.63X1.5"X4
- Top Mount Rectangular, Pin Fins 48.000" (1219.20mm) 1.500" (38.10mm) Adhesive - 0.630" (16.00mm) - -
V2203B
ASSMANN WSW Components
Inquiry
-
-
MOQ: 1  MPQ: 1
FINGER-SHAPED-HEATSINK 8K/W
- Board Level Rectangular, Fins 1.880" (47.75mm) 1.400" (35.56mm) Bolt On - 1.250" (31.75mm) 1.0W @ 10°C Black Anodized
628-65ABT5
Wakefield-Vette
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK CPU 43MM SQ BLK H=.65"
628 Top Mount Square, Pin Fins 1.750" (44.45mm) 1.700" (43.18mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.650" (16.51mm) 3.0W @ 20°C Black Anodized