- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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Discover 6 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 days |
-
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MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
|
Top Mount | Copper | 0.500" (12.70mm) | 1.030" (26.16mm) | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | 1.180" (29.97mm) | 1.000" (25.40mm) | Clip and PC Pin | TO-220 | 0.500" (12.70mm) | 2.0W @ 40°C | 8.00°C/W @ 500 LFM | Tin |
