- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
Discover 3 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
CTS Thermal Management Products |
2,562
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK PWR W/PINS BLACK TO-220
|
7 | Board Level, Vertical | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 40°C | - | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
283
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-3 LOW PROFILE .375"
|
- | Board Level | 1.750" (44.45mm) | Bolt On | TO-3 | 0.375" (9.52mm) | 10.0W @ 70°C | 3.00°C/W @ 400 LFM | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level | 1.750" (44.45mm) | Bolt On and Board Mounts | TO-3 | 0.375" (9.52mm) | 16.0W @ 90°C | 5.00°C/W @ 200 LFM |
