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Discover 44 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Material Finish | |
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Ohmite |
8,370
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK AND CLIP FOR TO-247 BLK
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W | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.260" (32.00mm) | 0.921" (23.40mm) | Clip and PC Pin | TO-247 | 0.630" (16.00mm) | 1.0W @ 20°C | 8.00°C/W @ 500 LFM | Black Anodized | ||
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CTS Thermal Management Products |
2,562
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK PWR W/PINS BLACK TO-220
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7 | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.650" (41.91mm) | Bolt On and PC Pin | TO-220 | 1.000" (25.40mm) | 6.0W @ 40°C | - | Black Anodized | ||
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ASSMANN WSW Components |
6,178
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level | Aluminum | Rectangular, Fins | 1.969" (50.00mm) | 1.181" (30.00mm) | Bolt On and PC Pin | TO-220 | 0.472" (12.00mm) | - | - | Black Anodized | ||
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American Technical Ceramics |
7,000
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3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | - | ||
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American Technical Ceramics |
7,836
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3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | - | ||
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American Technical Ceramics |
7,836
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3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.080" (2.03mm) | 0.050" (1.27mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | - | ||
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American Technical Ceramics |
500
|
3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | - | ||
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American Technical Ceramics |
936
|
3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | - | ||
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American Technical Ceramics |
936
|
3 days |
-
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MOQ: 1 MPQ: 1
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THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | - | ||
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Wakefield-Vette |
543
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CER TO-220 TO-247
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- | Board Level, Vertical | Ceramic | Rectangular, Fins | 0.803" (20.40mm) | 1.339" (34.00mm) | Solderable Feet | TO-220, TO-247 | 1.512" (38.40mm) | - | 3.80°C/W @ 200 LFM | - | ||
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ASSMANN WSW Components |
539
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 36.83X17.80MM
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- | Board Level | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 0.700" (17.78mm) | Bolt On | TO-220 | 0.850" (21.60mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
496
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 1.500" (38.10mm) | 1.772" (45.00mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
283
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 LOW PROFILE .375"
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- | Board Level | Aluminum | Rectangular, Fins | 2.000" (50.80mm) | 1.750" (44.45mm) | Bolt On | TO-3 | 0.375" (9.52mm) | 10.0W @ 70°C | 3.00°C/W @ 400 LFM | Black Anodized | ||
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ASSMANN WSW Components |
592
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.378" (35.00mm) | Bolt On and PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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ASSMANN WSW Components |
473
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.374" (34.90mm) | PC Pin | SOT-32, TO-220, TOP-3 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
75
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3 days |
-
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MOQ: 1 MPQ: 1
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COPPER HEATSINK 60X60X14MM
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- | Top Mount | Copper | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | Push Pin | BGA | 0.551" (14.00mm) | - | 1.70°C/W @ 200 LFM | AavSHIELD 3C | ||
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ASSMANN WSW Components |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK BLK ALUM TO-220 DUAL
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- | Board Level | Aluminum | Rectangular, Fins | 1.450" (36.83mm) | 1.750" (44.45mm) | Bolt On | TO-220 (Dual) | 0.370" (9.40mm) | - | - | Black Anodized | ||
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|
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ASSMANN WSW Components |
96
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Board Level, Vertical | Aluminum | Rectangular, Fins | 2.500" (63.50mm) | 1.374" (34.90mm) | Bolt On and PC Pin | TO-220 | 0.500" (12.70mm) | - | - | Black Anodized | ||
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Aluminum Nitride Ceramic | Rectangular | 0.110" (2.79mm) | 0.110" (2.79mm) | SMD Pad | - | 0.040" (1.02mm) | - | - | - | ||
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|
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American Technical Ceramics |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
THERMAL CONDUCTOR Q-BRIDGE
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Q-Bridge | Heat Spreader | Beryllium Oxide Ceramic | Rectangular | 0.050" (1.27mm) | 0.050" (1.27mm) | SMD Pad | - | 0.025" (0.64mm) | - | - | - |
