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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 3 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Aavid, Thermal Division of Boyd Corporation |
283
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3 days |
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 LOW PROFILE .375"
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2.000" (50.80mm) | Bolt On | TO-3 | 0.375" (9.52mm) | 10.0W @ 70°C | 3.00°C/W @ 400 LFM | ||
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ASSMANN WSW Components |
Inquiry
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-
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MOQ: 1 MPQ: 1
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HEATSINK BLK ALUM TO-220 DUAL
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1.450" (36.83mm) | Bolt On | TO-220 (Dual) | 0.370" (9.40mm) | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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2.000" (50.80mm) | Bolt On and Board Mounts | TO-3 | 0.375" (9.52mm) | 16.0W @ 90°C | 5.00°C/W @ 200 LFM |
