Discover 6 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Material Shape Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Material Finish
LTN20069
Wakefield-Vette
38,100
3 days
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MOQ: 1  MPQ: 1
HEAT SINK BGA/PGA 16.5X16.5X8.9
Penguin Board Level Aluminum Square, Fins 0.653" (16.59mm) Thermal Tape, Adhesive (Included) Assorted (BGA, LGA, CPU, ASIC...) 0.350" (8.89mm) - 8.00°C/W @ 500 LFM Black Anodized
D10650-40
Wakefield-Vette
4,209
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 100PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.650" (16.51mm) Thermal Tape, Adhesive (Not Included) BGA 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -
D10650-40T1E
Wakefield-Vette
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK 100PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.650" (16.51mm) Thermal Tape, Adhesive (Included) BGA 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -
D10650-40T3
Wakefield-Vette
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK 100PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.650" (16.51mm) Thermal Tape, Adhesive (Included) BGA 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -
D10650-40T5
Wakefield-Vette
Inquiry
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-
MOQ: 1  MPQ: 1
HEATSINK 100PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.650" (16.51mm) Thermal Tape, Adhesive (Included) BGA 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -
D10650-40T4E
Wakefield-Vette
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK 100PQFP COMPOSITE
Deltem Top Mount Composite Square, Pin Fins 0.650" (16.51mm) Thermal Tape, Adhesive (Included) BGA 0.400" (10.16mm) 2.0W @ 40°C 25.00°C/W @ 350 LFM -