- Attachment Method：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Apex Microtechnology |
2
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 6P DIP
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Board Level | Square, Pin Fins | 2.500" (63.50mm) | Bolt On | 6-DIP | 0.900" (22.86mm) | 3.0W @ 20°C | 30.00°C/W @ 500 LFM | 5.60°C/W | ||
|
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Apex Microtechnology |
10
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SIP
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Board Level, Vertical | Rectangular, Fins | 1.650" (41.91mm) | Bolt On and PC Pin | - | 1.000" (25.40mm) | - | - | - |
