Discover 24 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Type Material Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Thermal Resistance @ Natural Material Finish
HS09
Apex Microtechnology
688
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO3
Board Level Aluminum Rhombus 1.630" (41.40mm) 1.290" (32.77mm) Bolt On TO-3 0.750" (19.05mm) 7.0W @ 80°C 14.00°C/W @ 200 LFM 11.70°C/W Black Anodized
HS01
Apex Microtechnology
422
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TOP MT TO-3
Top Mount Aluminum Rhombus 1.600" (40.64mm) 1.000" (25.40mm) Bolt On TO-3 1.000" (25.40mm) 1.5W @ 20°C 2.00°C/W @ 600 LFM 11.60°C/W Black Anodized
HS02
Apex Microtechnology
381
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 8P TO-3 4.5C/W
Board Level Aluminum Square, Pin Fins 1.810" (45.97mm) 1.810" (45.97mm) Bolt On TO-3 1.500" (38.10mm) 10.0W @ 50°C 2.00°C/W @ 300 LFM 4.50°C/W Black Anodized
HS13
Apex Microtechnology
87
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO3
Board Level Aluminum Rectangular, Fins 5.421" (139.70mm) 4.812" (122.22mm) Bolt On TO-3 1.310" (33.27mm) - 0.40°C/W @ 800 LFM 1.48°C/W Black Anodized
HS14
Apex Microtechnology
48
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 8P TO-3 1.7C/W
Board Level Aluminum Rectangular, Fins 3.000" (76.20mm) 4.812" (122.22mm) Bolt On TO-3 1.310" (33.27mm) - 1.00°C/W @ 200 LFM 2.00°C/W Black Anodized
HS18
Apex Microtechnology
31
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P DIP
Board Level Aluminum Rectangular, Fins 5.421" (139.70mm) 4.612" (117.14mm) Bolt On PDIP 1.500" (38.10mm) - - 1.00°C/W Black Anodized
HS27
Apex Microtechnology
100
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P PWR SIP
Board Level Aluminum Rectangular, Fins 3.000" (76.20mm) 2.360" (59.94mm) Bolt On and PC Pin PSIP 0.630" (16.00mm) - - 5.30°C/W Black Anodized
HS03
Apex Microtechnology
34
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 8P TO-3 1.7C/W
Board Level Aluminum Rectangular, Fins 3.000" (76.20mm) 4.750" (120.65mm) Bolt On TO-3 1.250" (31.75mm) 15.0W @ 30°C 1.00°C/W @ 200 LFM 1.70°C/W Black Anodized
HS06
Apex Microtechnology
9
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P DIP .6C/W
Board Level Aluminum Rectangular, Fins 5.421" (139.70mm) 6.250" (158.75mm) Bolt On PDIP 2.000" (50.80mm) - 0.30°C/W @ 600 LFM 0.96°C/W Black Anodized
HS26
Apex Microtechnology
11
3 days
-
MOQ: 1  MPQ: 1
HEATSINK OPEN FRAME 0.5C/W
Board Level Aluminum Rectangular, Fins 9.000" (228.60mm) 6.620" (168.15mm) Bolt On - 1.780" (45.21mm) - - 0.50°C/W Black Anodized
HS33
Apex Microtechnology
12
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FOR DK AND HQ PACKAGES
Board Level Aluminum Rectangular, Fins 1.500" (38.10mm) 0.400" (10.16mm) Bolt On - 0.400" (10.16mm) - - 16.00°C/W -
HS04
Apex Microtechnology
9
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 8P TO-3 .95C/W
Board Level Aluminum Rectangular, Fins 3.000" (76.20mm) 4.750" (120.65mm) Bolt On TO-3 3.000" (76.20mm) 50.0W @ 60°C 0.35°C/W @ 300 LFM 0.95°C/W Black Anodized
HS24
Apex Microtechnology
31
3 days
-
MOQ: 1  MPQ: 1
HEATSINK SMT
Top Mount Copper Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) SMD Pad SMD 0.400" (10.16mm) - 16.00°C/W @ 600 LFM 50.00°C/W Solderable
HS29
Apex Microtechnology
6
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P TO220 2.7C/W
Board Level Aluminum Rectangular, Fins 5.906" (150.00mm) 1.770" (44.96mm) Clip TO-220 1.181" (30.00mm) - - 2.70°C/W Black Anodized
HS16
Apex Microtechnology
4
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 10P DIP
Board Level Aluminum Rectangular, Fins 3.000" (76.20mm) 4.812" (122.22mm) Bolt On 10-PowerDip 1.310" (33.27mm) - 0.60°C/W @ 600 LFM 2.00°C/W Black Anodized
HS05
Apex Microtechnology
7
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 8P TO-3 15W
Board Level Aluminum Rectangular, Fins 4.750" (120.65mm) 5.421" (139.70mm) Bolt On TO-3 2.630" (66.80mm) 20.0W @ 20°C 0.30°C/W @ 500 LFM 0.85°C/W Black Anodized
HS31
Apex Microtechnology
4
3 days
-
MOQ: 1  MPQ: 1
HEATSINK OPEN FRAME
Board Level Aluminum Rectangular, Fins 5.421" (139.70mm) 4.812" (122.22mm) Bolt On - 1.310" (33.27mm) - 0.40°C/W @ 800 LFM 1.46°C/W Black Anodized
HS20
Apex Microtechnology
15
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 10P/12P PWR SIP
Board Level Aluminum Rectangular, Fins 3.500" (88.90mm) 5.350" (135.89mm) Bolt On - 2.276" (57.81mm) - - 1.30°C/W Black Anodized
HS11
Apex Microtechnology
5
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 2TO-3 & 12P DIP H2O
Board Level Aluminum Rectangular, Fins 6.000" (152.40mm) 8.000" (203.00mm) Bolt On TO-3, PDIP 2.000" (50.80mm) - - 0.68°C/W Black Anodized
HS23
Apex Microtechnology
5
3 days
-
MOQ: 1  MPQ: 1
HEATSINK WAKEFIELD 232-200AB
Board Level, Vertical Aluminum Rectangular, Fins 2.000" (50.80mm) 1.380" (35.05mm) Bolt On and PC Pin TO-220 0.500" (12.70mm) - - 10.00°C/W Black Anodized