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Discover 27 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
321
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 HORZ MT NO HOLES
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641 | Board Level | Aluminum | Rectangular, Angled Fins | 4.125" (104.77mm) | Press Fit | TO-3 | 1.000" (25.40mm) | 15.0W @ 36°C | 0.90°C/W @ 250 LFM | 2.40°C/W | Black Anodized | ||
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Wakefield-Vette |
255
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK POWER NO MNT HOLES BLK
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421 | Board Level | Aluminum | Rectangular, Fins | 4.750" (120.65mm) | Press Fit | TO-3, DO-5, Stud Mount | 2.625" (66.67mm) | 50.0W @ 58°C | 0.70°C/W @ 250 LFM | 1.16°C/W | Black Anodized | ||
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Apex Microtechnology |
48
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 1.7C/W
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 4.812" (122.22mm) | Bolt On | TO-3 | 1.310" (33.27mm) | - | 1.00°C/W @ 200 LFM | 2.00°C/W | Black Anodized | ||
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Wakefield-Vette |
77
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-3 PWR HORZ MT BLK
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641 | Board Level | Aluminum | Rectangular, Angled Fins | 4.125" (104.77mm) | Bolt On | TO-3 | 1.000" (25.40mm) | 15.0W @ 36°C | 0.90°C/W @ 250 LFM | 2.40°C/W | Black Anodized | ||
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Wakefield-Vette |
83
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 3X1.5X5" SSR/IGBT/POWER
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394 | Top Mount | Aluminum | Rectangular, Fins | 5.000" (127.00mm) | Bolt On | Power Modules | 1.500" (38.10mm) | - | 0.90°C/W @ 500 LFM | 1.80°C/W | Black Anodized | ||
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Wakefield-Vette |
50
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 3X5X2.5" POWER/IGBT
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395 | Board Level | Aluminum | Rectangular, Fins | 5.000" (127.00mm) | Bolt On | Power Modules | 2.500" (63.50mm) | - | 0.50°C/W @ 500 LFM | 1.10°C/W | Black Anodized | ||
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Wakefield-Vette |
37
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 3X5X1.38" POWER/IGBT
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396 | Board Level | Aluminum | Rectangular, Fins | 5.000" (127.00mm) | Bolt On | Power Modules | 1.380" (35.1mm) | - | 1.10°C/W @ 500 LFM | 1.80°C/W | Black Anodized | ||
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Wakefield-Vette |
62
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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511 | Top Mount | Aluminum | Rectangular, Fins | 5.210" (132.33mm) | Adhesive | Power Modules | 2.410" (61.21mm) | - | - | 0.90°C/W | - | ||
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Apex Microtechnology |
100
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 12P PWR SIP
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 2.360" (59.94mm) | Bolt On and PC Pin | PSIP | 0.630" (16.00mm) | - | - | 5.30°C/W | Black Anodized | ||
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Wakefield-Vette |
68
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Top Mount | Aluminum | Rectangular, Fins | 7.380" (187.45mm) | Adhesive | Power Modules | 3.136" (79.65mm) | - | - | 0.56°C/W | - | ||
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Wakefield-Vette |
19
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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511 | Top Mount | Aluminum | Rectangular, Fins | 5.210" (132.33mm) | Adhesive | Power Modules | 2.350" (59.69mm) | - | - | 0.90°C/W | - | ||
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Wakefield-Vette |
27
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Top Mount | Aluminum | Rectangular, Fins | 7.380" (187.45mm) | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.56°C/W | - | ||
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Apex Microtechnology |
34
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 1.7C/W
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 4.750" (120.65mm) | Bolt On | TO-3 | 1.250" (31.75mm) | 15.0W @ 30°C | 1.00°C/W @ 200 LFM | 1.70°C/W | Black Anodized | ||
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t-Global Technology |
120
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X25.4X0.062MM
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PH3n | Heat Spreader | Copper | Rectangular | 1.000" (25.40mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
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t-Global Technology |
160
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3 76.2X19.1X0.21MM
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PH3 | Heat Spreader | Copper | Rectangular | 0.750" (19.05mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.008" (0.21mm) | - | - | - | Polyester | ||
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Apex Microtechnology |
9
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 8P TO-3 .95C/W
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 4.750" (120.65mm) | Bolt On | TO-3 | 3.000" (76.20mm) | 50.0W @ 60°C | 0.35°C/W @ 300 LFM | 0.95°C/W | Black Anodized | ||
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Apex Microtechnology |
4
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 10P DIP
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Apex Precision Power | Board Level | Aluminum | Rectangular, Fins | 4.812" (122.22mm) | Bolt On | 10-PowerDip | 1.310" (33.27mm) | - | 0.60°C/W @ 600 LFM | 2.00°C/W | Black Anodized | ||
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t-Global Technology |
51
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X12.07X0.062MM
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PH3n | Heat Spreader | Copper | Rectangular | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester | ||
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t-Global Technology |
21
|
3 days |
-
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MOQ: 1 MPQ: 1
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PH3N NANO 76.2X12.07X0.07MM
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PH3n | Heat Spreader | Copper | Rectangular | 0.500" (12.70mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.003" (0.07mm) | - | - | - | Polyester | ||
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|
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t-Global Technology |
49
|
3 days |
-
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MOQ: 1 MPQ: 1
|
PH3N NANO 76.2X19.1X0.062MM
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PH3n | Heat Spreader | Copper | Rectangular | 0.750" (19.05mm) | Adhesive | Assorted (BGA, LGA, CPU, ASIC...) | 0.002" (0.06mm) | - | - | - | Polyester |
