Discover 16 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Material Shape Width Attachment Method Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Natural Material Finish
511-3U
Wakefield-Vette
62
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FOR PWR MOD/IGBT/RELAY
511 Top Mount Aluminum Rectangular, Fins 5.210" (132.33mm) Adhesive Power Modules 2.410" (61.21mm) 0.90°C/W -
HS27
Apex Microtechnology
100
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P PWR SIP
Apex Precision Power Board Level Aluminum Rectangular, Fins 2.360" (59.94mm) Bolt On and PC Pin PSIP 0.630" (16.00mm) 5.30°C/W Black Anodized
510-3U
Wakefield-Vette
68
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FOR PWR MOD/IGBT/RELAY
510 Top Mount Aluminum Rectangular, Fins 7.380" (187.45mm) Adhesive Power Modules 3.136" (79.65mm) 0.56°C/W -
511-3M
Wakefield-Vette
19
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FOR PWR MOD/IGBT/RELAY
511 Top Mount Aluminum Rectangular, Fins 5.210" (132.33mm) Adhesive Power Modules 2.350" (59.69mm) 0.90°C/W -
510-3M
Wakefield-Vette
27
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FOR PWR MOD/IGBT/RELAY
510 Top Mount Aluminum Rectangular, Fins 7.380" (187.45mm) Adhesive Power Modules 3.106" (78.89mm) 0.56°C/W -
PH3N-76.2-25.4-0.062-1A
t-Global Technology
120
3 days
-
MOQ: 1  MPQ: 1
PH3N NANO 76.2X25.4X0.062MM
PH3n Heat Spreader Copper Rectangular 1.000" (25.40mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.002" (0.06mm) - Polyester
PH3-76.2-19.1-0.21-1A
t-Global Technology
160
3 days
-
MOQ: 1  MPQ: 1
PH3 76.2X19.1X0.21MM
PH3 Heat Spreader Copper Rectangular 0.750" (19.05mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.008" (0.21mm) - Polyester
PH3N-76.2-12.7-0.062-1A
t-Global Technology
51
3 days
-
MOQ: 1  MPQ: 1
PH3N NANO 76.2X12.07X0.062MM
PH3n Heat Spreader Copper Rectangular 0.500" (12.70mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.002" (0.06mm) - Polyester
PH3N-76.2-12.7-0.07-1A
t-Global Technology
21
3 days
-
MOQ: 1  MPQ: 1
PH3N NANO 76.2X12.07X0.07MM
PH3n Heat Spreader Copper Rectangular 0.500" (12.70mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.003" (0.07mm) - Polyester
PH3N-76.2-19.1-0.062-1A
t-Global Technology
49
3 days
-
MOQ: 1  MPQ: 1
PH3N NANO 76.2X19.1X0.062MM
PH3n Heat Spreader Copper Rectangular 0.750" (19.05mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.002" (0.06mm) - Polyester
PH3N-76.2-19.1-0.07-1A
t-Global Technology
11
3 days
-
MOQ: 1  MPQ: 1
PH3N NANO 76.2X19.1X0.07MM
PH3n Heat Spreader Copper Rectangular 0.750" (19.05mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.003" (0.07mm) - Polyester
PH3N-76.2-25.4-0.07-1A
t-Global Technology
44
3 days
-
MOQ: 1  MPQ: 1
PH3N NANO 76.2X25.4X0.07MM
PH3n Heat Spreader Copper Rectangular 1.000" (25.40mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.003" (0.07mm) - Polyester
PH3-76.2-12.7-0.21-1A
t-Global Technology
24
3 days
-
MOQ: 1  MPQ: 1
PH3 76.2X12.07X0.21MM
PH3 Heat Spreader Copper Rectangular 0.500" (12.70mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.008" (0.21mm) - Polyester
PH3-76.2-25.4-0.21-1A
t-Global Technology
20
3 days
-
MOQ: 1  MPQ: 1
PH3 76.2X25.4X0.21MM
PH3 Heat Spreader Copper Rectangular 1.000" (25.40mm) Adhesive Assorted (BGA, LGA, CPU, ASIC...) 0.008" (0.21mm) - Polyester
512-3U
Wakefield-Vette
3
3 days
-
MOQ: 1  MPQ: 1
HEATSINK FOR PWR MOD/IGBT/RELAY
512 Top Mount Aluminum Rectangular, Fins 7.200" (182.88mm) Adhesive Power Modules 2.410" (61.21mm) 0.90°C/W -
512-3M
Wakefield-Vette
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK FOR PWR MOD/IGBT/RELAY
512 Top Mount Aluminum Rectangular, Fins 7.200" (182.88mm) Adhesive Power Modules 2.350" (59.69mm) 0.90°C/W -