- Manufacturer：
-
- Material：
-
- Width：
-
- Attachment Method：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Selected conditions:
Discover 11 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
113
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
|
510 | Top Mount | Aluminum | 7.380" (187.45mm) | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.38°C/W | - | ||
|
|
|
Wakefield-Vette |
42
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
|
511 | Top Mount | Aluminum | 5.210" (132.33mm) | Adhesive | Power Modules | 2.410" (61.21mm) | - | - | 0.65°C/W | - | ||
|
|
|
Wakefield-Vette |
40
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
|
511 | Top Mount | Aluminum | 5.210" (132.33mm) | Adhesive | Power Modules | 2.350" (59.69mm) | - | - | 0.65°C/W | - | ||
|
|
|
Ohmite |
18
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM EXTRUSION 6"
|
HS | Board Level, Vertical | Aluminum Alloy | 4.125" (104.77mm) | Bolt On | Aluminum Housed Resistor | 1.750" (44.45mm) | - | - | 0.93°C/W | Unfinished | ||
|
|
|
Wakefield-Vette |
33
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
|
510 | Top Mount | Aluminum | 7.380" (187.45mm) | Adhesive | Power Modules | 3.136" (79.65mm) | - | - | 0.38°C/W | - | ||
|
|
|
Wakefield-Vette |
18
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK HF 7.2X6.0X2.41 NONMIL
|
512 | Top Mount | Aluminum | 7.200" (182.88mm) | Adhesive | Power Modules | 2.410" (61.21mm) | - | - | 0.65°C/W | - | ||
|
|
|
Wakefield-Vette |
15
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR PWR MOD/IGBT/RELAY
|
512 | Top Mount | Aluminum | 7.200" (182.88mm) | Adhesive | Power Modules | 2.350" (59.69mm) | - | - | 0.65°C/W | - | ||
|
|
|
Apex Microtechnology |
5
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 2TO-3 & 12P DIP H2O
|
Apex Precision Power | Board Level | Aluminum | 8.000" (203.00mm) | Bolt On | TO-3, PDIP | 2.000" (50.80mm) | - | - | 0.68°C/W | Black Anodized | ||
|
|
|
Ohmite |
4
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
ALUMINUM EXTRUSION 6"
|
HS | Board Level, Vertical | Aluminum Alloy | 9.750" (247.65mm) | Bolt On | Aluminum Housed Resistor | 2.280" (57.91mm) | - | - | 0.44°C/W | Unfinished | ||
|
|
|
Apex Microtechnology |
8
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK SIP 1.33C/W
|
Apex Precision Power | Board Level, Vertical | Aluminum | 2.953" (75.00mm) | Clip | SIP | 1.338" (34.00mm) | - | - | 1.33°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK NATURAL CONVECTIONC2025
|
476 | Board Level | Aluminum | 5.000" (127.00mm) | Bolt On | Stud Mounted Diode | 5.000" (127.00mm) | 50.0W @ 25°C | 0.20°C/W @ 500 LFM | 0.50°C/W | Black Anodized |
