- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Natural | |
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Apex Microtechnology |
5
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 2TO-3 & 12P DIP H2O
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Board Level | 8.000" (203.00mm) | Bolt On | TO-3, PDIP | 2.000" (50.80mm) | 0.68°C/W | ||
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Apex Microtechnology |
8
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SIP 1.33C/W
|
Board Level, Vertical | 2.953" (75.00mm) | Clip | SIP | 1.338" (34.00mm) | 1.33°C/W |
