Series:
Attachment Method:
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Forced Air Flow:
Discover 3 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Type Attachment Method Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow
235-85AB
Wakefield-Vette
7,342
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-220 CLIP-ON BLK
235 Board Level Bolt On 2.0W @ 40°C 6.80°C/W @ 400 LFM
ATS-PCB1032
Advanced Thermal Solutions Inc.
2,995
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CLIP-ON TO-220 BLK
- Board Level Bolt On - 9.00°C/W @ 200 LFM
ATS-PCB1033
Advanced Thermal Solutions Inc.
2,995
3 days
-
MOQ: 1  MPQ: 1
HEATSINK CLIP-ON TO-220 W/TAB
- Board Level, Vertical Bolt On and PC Pin - 9.00°C/W @ 200 LFM