Thermal - Heat Sinks - Zui Ai Technology（Taiwan）Company.

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Type：

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Attachment Method：

Package Cooled：

Height Off Base (Height of Fin)：

Power Dissipation @ Temperature Rise：

Thermal Resistance @ Forced Air Flow：

Thermal Resistance @ Natural：

Material Finish：

Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Type	Material	Shape	Width	Attachment Method	Package Cooled	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material Finish
Image	Part Number	Manufacturer	Quantity	Delivery period	Unit Price	Buy	Description	Series	Type	Material	Shape	Width	Attachment Method	Package Cooled	Height Off Base (Height of Fin)	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material Finish
	235-85AB	Wakefield-Vette	7,342	3 days	-	HEATSINK TO-220 CLIP-ON BLK MOQ: 1 MPQ: 1	HEATSINK TO-220 CLIP-ON BLK	235	Board Level	Aluminum	Rectangular, Fins	1.000" (25.40mm)	Bolt On	TO-220	0.500" (12.70mm)	2.0W @ 40°C	6.80°C/W @ 400 LFM	20.00°C/W	Black Anodized
	D10850-40	Wakefield-Vette	900	3 days	-	HEATSINK 128PQFP COMPOSITE MOQ: 1 MPQ: 1	HEATSINK 128PQFP COMPOSITE	Deltem	Top Mount	Composite	Square, Pin Fins	0.850" (21.59mm)	Thermal Tape, Adhesive (Not Included)	BGA	0.400" (10.16mm)	2.5W @ 90°C	20.00°C/W @ 100 LFM	-	-
	ATS-PCB1032	Advanced Thermal Solutions Inc.	2,995	3 days	-	HEATSINK CLIP-ON TO-220 BLK MOQ: 1 MPQ: 1	HEATSINK CLIP-ON TO-220 BLK	-	Board Level	Aluminum	Rectangular, Fins	1.000" (25.40mm)	Bolt On	TO-220	0.500" (12.70mm)	-	9.00°C/W @ 200 LFM	20.00°C/W	Black Anodized
	ATS-PCB1033	Advanced Thermal Solutions Inc.	2,995	3 days	-	HEATSINK CLIP-ON TO-220 W/TAB MOQ: 1 MPQ: 1	HEATSINK CLIP-ON TO-220 W/TAB	-	Board Level, Vertical	Aluminum	Rectangular, Fins	1.000" (25.40mm)	Bolt On and PC Pin	TO-220	0.500" (12.70mm)	-	9.00°C/W @ 200 LFM	20.00°C/W	Black Anodized
	566902B00000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	Board Level	Aluminum	Rectangular, Fins	1.000" (25.40mm)	Clip	TO-220, TO-262	0.500" (12.70mm)	2.0W @ 40°C	9.00°C/W @ 200 LFM	18.80°C/W	Black Anodized
	566902B04000G	Aavid, Thermal Division of Boyd Corporation	Inquiry	-	-	BOARD LEVEL HEAT SINK MOQ: 1 MPQ: 1	BOARD LEVEL HEAT SINK	-	Board Level, Vertical	Aluminum	Rectangular, Fins	1.000" (25.40mm)	Clip and PC Pin	TO-220, TO-262	0.500" (12.70mm)	2.0W @ 40°C	9.00°C/W @ 200 LFM	18.80°C/W	Black Anodized
	D10850-40T1E	Wakefield-Vette	Inquiry	-	-	HEATSINK 128PQFP COMPOSITE MOQ: 1 MPQ: 1	HEATSINK 128PQFP COMPOSITE	Deltem	Top Mount	Composite	Square, Pin Fins	0.850" (21.59mm)	Thermal Tape, Adhesive (Included)	BGA	0.400" (10.16mm)	2.5W @ 90°C	20.00°C/W @ 100 LFM	-	-
	D10850-40T3	Wakefield-Vette	Inquiry	-	-	HEATSINK 128PQFP COMPOSITE MOQ: 1 MPQ: 1	HEATSINK 128PQFP COMPOSITE	Deltem	Top Mount	Composite	Square, Pin Fins	0.850" (21.59mm)	Thermal Tape, Adhesive (Included)	BGA	0.400" (10.16mm)	2.5W @ 90°C	20.00°C/W @ 100 LFM	-	-
	D10850-40T5	Wakefield-Vette	Inquiry	-	-	HEATSINK 128PQFP COMPOSITE MOQ: 1 MPQ: 1	HEATSINK 128PQFP COMPOSITE	Deltem	Top Mount	Composite	Square, Pin Fins	0.850" (21.59mm)	Thermal Tape, Adhesive (Included)	BGA	0.400" (10.16mm)	2.5W @ 90°C	20.00°C/W @ 100 LFM	-	-
	D10850-40T4E	Wakefield-Vette	Inquiry	-	-	HEATSINK 128PQFP COMPOSITE MOQ: 1 MPQ: 1	HEATSINK 128PQFP COMPOSITE	Deltem	Top Mount	Composite	Square, Pin Fins	0.850" (21.59mm)	Thermal Tape, Adhesive (Included)	BGA	0.400" (10.16mm)	2.5W @ 90°C	20.00°C/W @ 100 LFM	-	-

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