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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Discover 33 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Width | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
12,250
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Copper | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Copper | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK D2PAK .4" HIGH SMD
|
- | Copper | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 days |
-
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MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .4" D2PAK
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- | Copper | 1.030" (26.16mm) | SMD Pad | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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Ohmite |
9,471
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263 BLACK
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D | Aluminum | 1.020" (25.91mm) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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|
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ASSMANN WSW Components |
1,010
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
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- | Copper | 1.031" (26.20mm) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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|
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Ohmite |
3,336
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Aluminum | 1.020" (25.91mm) | Solderable Feet | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Advanced Thermal Solutions Inc. |
2,297
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
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- | Copper | 1.031" (26.20mm) | - | 0.402" (10.21mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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ASSMANN WSW Components |
3,600
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Copper | 1.031" (26.20mm) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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ASSMANN WSW Components |
3,836
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Copper | 1.031" (26.20mm) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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|
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ASSMANN WSW Components |
3,836
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 12.70X26.20MM
|
- | Copper | 1.031" (26.20mm) | SMD Pad | 0.390" (9.91mm) | - | - | 23.00°C/W | Tin | ||
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Ohmite |
1,400
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
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D | Aluminum | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Ohmite |
1,511
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Aluminum | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Ohmite |
1,511
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Aluminum | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Advanced Thermal Solutions Inc. |
2,750
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Copper | 1.031" (26.20mm) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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Advanced Thermal Solutions Inc. |
2,833
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Copper | 1.031" (26.20mm) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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Advanced Thermal Solutions Inc. |
2,833
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-263 COPPER
|
- | Copper | 1.031" (26.20mm) | - | 0.401" (10.20mm) | - | 9.50°C/W @ 200 LFM | 18.00°C/W | Tin | |||
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Wakefield-Vette |
1,500
|
3 days |
-
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MOQ: 1 MPQ: 1
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TO-263 HEAT SINK ANODZD REEL
|
219 | Aluminum | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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|
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Wakefield-Vette |
1,848
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
TO-263 HEAT SINK ANODZD REEL
|
219 | Aluminum | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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|
|
Wakefield-Vette |
1,848
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
TO-263 HEAT SINK ANODZD REEL
|
219 | Aluminum | 1.020" (25.91mm) | Solderable Feet | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized |
