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- Material：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Discover 25 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Aavid, Thermal Division of Boyd Corporation |
11,699
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3 days |
-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEATSINK .375" D2PAK
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- | Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
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Ohmite |
9,471
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263 BLACK
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D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Ohmite |
3,336
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263
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D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Ohmite |
1,400
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263
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D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Ohmite |
1,511
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263
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D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Ohmite |
1,511
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Degreased | ||
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Wakefield-Vette |
1,500
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3 days |
-
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MOQ: 1 MPQ: 1
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TO-263 HEAT SINK ANODZD REEL
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219 | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,848
|
3 days |
-
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MOQ: 1 MPQ: 1
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TO-263 HEAT SINK ANODZD REEL
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219 | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,848
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3 days |
-
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MOQ: 1 MPQ: 1
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TO-263 HEAT SINK ANODZD REEL
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219 | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
947
|
3 days |
-
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MOQ: 1 MPQ: 1
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TO-263 HEAT SINK ANODZD
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219 | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Ohmite |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263
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D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Ohmite |
106
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263
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D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Ohmite |
106
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | Top Mount | Aluminum | Rectangular, Fins | 0.500" (12.70mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Board Level | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | Clip | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK, STAMPING, TO-263, 14.
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- | Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | - | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-202 CLIP-ON 5W
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- | Board Level | Aluminum | Rectangular | 0.900" (22.86mm) | Clip | TO-202 | 0.420" (10.67mm) | 1.0W @ 20°C | 8.00°C/W @ 200 LFM | 16.80°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
- | Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | Clip and PC Pin | TO-202 | 0.420" (10.67mm) | 3.0W @ 50°C | 8.00°C/W @ 200 LFM | 16.80°C/W | Black Anodized |
