- Material:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Power Dissipation @ Temperature Rise:
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Material Finish:
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Discover 7 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | ||
Aavid, Thermal Division of Boyd Corporation |
11,699
|
3 days |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | Clip | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-202 CLIP-ON 5W
|
Board Level | Aluminum | Rectangular | 0.900" (22.86mm) | Clip | TO-202 | 0.420" (10.67mm) | 1.0W @ 20°C | 8.00°C/W @ 200 LFM | 16.80°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | Clip and PC Pin | TO-220 | 0.420" (10.67mm) | 3.0W @ 60°C | 6.00°C/W @ 500 LFM | 20.40°C/W | Black Anodized | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
|
Top Mount | Copper | Rectangular, Fins | 0.590" (14.99mm) | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Board Level, Vertical | Aluminum | Rectangular, Fins | 0.900" (22.86mm) | Clip and PC Pin | TO-202 | 0.420" (10.67mm) | 3.0W @ 50°C | 8.00°C/W @ 200 LFM | 16.80°C/W | Black Anodized |