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- Thermal Resistance @ Natural：
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Discover 24,397 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
1,155
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 40X40X23MM PIN
|
910 | Square, Pin Fins | 1.575" (40.01mm) | Clip | BGA | 0.892" (22.65mm) | 2.00°C/W @ 200 LFM | 8.30°C/W | Black Anodized | ||
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CTS Thermal Management Products |
199
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
969
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
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|
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Wakefield-Vette |
881
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12MM PIN
|
910 | Square, Pin Fins | 1.575" (40.01mm) | Clip | BGA | 0.457" (11.60mm) | 2.80°C/W @ 200 LFM | 9.20°C/W | Black Anodized | ||
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|
|
CTS Thermal Management Products |
438
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
310
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 19.5MM
|
- | Square, Pin Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 3.60°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
CTS Thermal Management Products |
2,815
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 1.90°C/W @ 200 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
258
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 24.5MM
|
- | Square, Pin Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 2.60°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
166
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X6MM XCUT CP
|
pushPIN | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.236" (6.00mm) | 21.10°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
298
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X10MM XCUT CP
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pushPIN | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 11.79°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
116
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X15MM XCUT FP
|
pushPIN | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 15.85°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
172
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X25MM XCUT FP
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pushPIN | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 8.72°C/W @ 100 LFM | - | Blue Anodized | |||
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|
Advanced Thermal Solutions Inc. |
101
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X35MM R-TAB CP
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pushPIN | Square, Fins | 1.575" (40.01mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.378" (35.00mm) | 2.80°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
|
Wakefield-Vette |
181
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X23MM ELLIPTICAL
|
910 | Square, Fins | 1.575" (40.01mm) | Clip | BGA | 0.892" (22.65mm) | 2.00°C/W @ 200 LFM | 8.30°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
897
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 14.5MM
|
- | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 4.60°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
136
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 19.5MM
|
- | Square, Fins | 1.575" (40.01mm) | Thermal Tape, Adhesive (Included) | BGA | 0.768" (19.50mm) | 3.20°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
342
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 40MM X 40MM X 12.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | 2.60°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
183
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 40X40X12.5MM
|
maxiFLOW, superGRIP | Square, Angled Fins | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.492" (12.50mm) | 2.60°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
109
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SUPERGRIP HEATSINK 40X40X17.5MM
|
superGRIP | Square, Fins | 1.575" (40.01mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | 3.20°C/W @ 200 LFM | - | Blue Anodized |
