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Discover 109,560 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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ASSMANN WSW Components |
6,712
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Aluminum | Rectangular, Fins | 0.334" (8.50mm) | 0.250" (6.35mm) | - | Press Fit | 6-Dip and 8-Dip | 0.189" (4.80mm) | - | - | 80.00°C/W | Black Anodized | ||
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ASSMANN WSW Components |
18,400
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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ASSMANN WSW Components |
18,715
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK ALUM DPAK TO-252
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- | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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ASSMANN WSW Components |
18,715
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK ALUM DPAK TO-252
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- | Copper | Rectangular, Fins | 0.320" (8.13mm) | 0.790" (20.07mm) | - | SMD Pad | D2Pak, TO-252 | 0.390" (9.91mm) | - | - | 25.00°C/W | Tin | ||
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ASSMANN WSW Components |
25,551
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM CPU
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- | Aluminum | Square, Pin Fins | 0.393" (10.00mm) | 0.393" (10.00mm) | - | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.275" (7.00mm) | - | - | 31.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
12,250
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,300
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK D2PAK .4" HIGH SMD
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- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
18,047
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-16 DIP BLACK .19"
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- | Aluminum | Rectangular, Fins | 0.250" (6.35mm) | 0.731" (18.57mm) | - | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.190" (4.83mm) | 0.4W @ 30°C | 50.00°C/W @ 200 LFM | 68.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
16,283
|
3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D2PAK
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- | Copper | Rectangular, Fins | 0.500" (12.70mm) | 1.030" (26.16mm) | - | SMD Pad | TO-263 (D2Pak) | 0.400" (10.16mm) | 1.3W @ 30°C | 8.00°C/W @ 300 LFM | 18.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
9,699
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3 days |
-
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MOQ: 1 MPQ: 1
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TOP MOUNT HEATSINK .4" D-PAK
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- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,750
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
4,764
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK SMT D-PAK/TO-252 TIN
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- | Copper | Rectangular, Fins | 0.315" (8.00mm) | 0.900" (22.86mm) | - | SMD Pad | TO-252 (DPAK) | 0.400" (10.16mm) | 0.8W @ 30°C | 12.50°C/W @ 600 LFM | 15.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
6,500
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-220
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- | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
6,648
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK TO-220
|
- | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
12,216
|
3 days |
-
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MOQ: 1 MPQ: 1
|
TOP MOUNT HEATSINK .45" D2PAK
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- | Copper | Rectangular, Fins | 0.763" (19.38mm) | 1.000" (25.40mm) | - | SMD Pad | TO-263 (D2Pak) | 0.450" (11.43mm) | 2.0W @ 30°C | 3.00°C/W @ 300 LFM | 11.00°C/W | Tin | ||
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Aavid, Thermal Division of Boyd Corporation |
11,699
|
3 days |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEATSINK .375" D2PAK
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- | Copper | Rectangular, Fins | 0.590" (14.99mm) | 1.020" (25.91mm) | - | SMD Pad | TO-263 (D2Pak), PowerSO-10 (MO-184), SO-10 | 0.375" (9.52mm) | 2.0W @ 40°C | 5.00°C/W @ 400 LFM | - | Tin | ||
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Wakefield-Vette |
17,584
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/DBL TAPE
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624 | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 25.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
5,813
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/ADH BLK
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624 | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Black Anodized |
