- Manufacturer：
-
- Series：
-
- Material：
-
- Shape：
-
- Length：
-
- Width：
-
- Package Cooled：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
- Material Finish：
-
- Selected conditions:
Discover 296 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Type | Material | Shape | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|
|
|
Wakefield-Vette |
38,100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK BGA/PGA 16.5X16.5X8.9
|
Penguin | Board Level | Aluminum | Square, Fins | 0.650" (16.51mm) | 0.653" (16.59mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.350" (8.89mm) | - | 8.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
17,584
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/DBL TAPE
|
624 | Top Mount | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | BGA | 0.250" (6.35mm) | - | 25.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
5,813
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 21MM SQ W/ADH BLK
|
624 | Top Mount | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
4,845
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 25MM SQ W/DBL TAPE
|
625 | Top Mount | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | BGA | 0.250" (6.35mm) | - | 12.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
5,941
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
2,805
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
3,997
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE .91"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 0.910" (23.11mm) | 0.910" (23.11mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | Black Anodized | ||
|
|
|
Wakefield-Vette |
2,779
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQ BLK W/TAPE
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 0.600" (15.24mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
Wakefield-Vette |
7,117
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 27.9MM SQ W/ADH BLK
|
658 | Top Mount | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
2,354
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.11"SQ
|
BDN | Top Mount | Aluminum | Square, Pin Fins | 1.110" (28.19mm) | 1.110" (28.19mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 7.20°C/W @ 400 LFM | 20.90°C/W | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
4,769
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 19MM X 19MM X 9MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | ASIC | 0.354" (9.00mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
2,973
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | BGA | 0.374" (9.50mm) | - | 26.20°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
860
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 17MM X 17MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | BGA | 0.374" (9.50mm) | - | 24.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
998
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | BGA | 0.374" (9.50mm) | - | 29.50°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
693
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 17MM X 17MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | BGA | 0.374" (9.50mm) | - | 28.00°C/W @ 200 LFM | - | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
1,953
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 25MM X 25MM X 9.5MM
|
- | Top Mount | Aluminum | Square, Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | BGA | 0.374" (9.50mm) | - | 15.30°C/W @ 200 LFM | - | Black Anodized | |||
|
|
|
CTS Thermal Management Products |
4,900
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||
|
|
Advanced Thermal Solutions Inc. |
975
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 15MM X 15MM X 7.5MM
|
maxiFLOW | Top Mount | Aluminum | Square, Angled Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | BGA | 0.295" (7.50mm) | - | 19.70°C/W @ 200 LFM | - | Blue Anodized | |||
|
|
|
CTS Thermal Management Products |
3,861
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,900
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Top Mount | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized |
