Discover 2 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Type Length Width Package Cooled Height Off Base (Height of Fin) Thermal Resistance @ Natural
HS29
Apex Microtechnology
6
3 days
-
MOQ: 1  MPQ: 1
HEATSINK 12P TO220 2.7C/W
Board Level 5.906" (150.00mm) 1.770" (44.96mm) TO-220 1.181" (30.00mm) 2.70°C/W
HS32
Apex Microtechnology
8
3 days
-
MOQ: 1  MPQ: 1
HEATSINK SIP 1.33C/W
Board Level, Vertical 6.000" (152.40mm) 2.953" (75.00mm) SIP 1.338" (34.00mm) 1.33°C/W