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- Material：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Material Finish：
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Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Type | Material | Length | Width | Attachment Method | Package Cooled | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Apex Microtechnology |
12
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR DK AND HQ PACKAGES
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Board Level | Aluminum | 1.500" (38.10mm) | 0.400" (10.16mm) | Bolt On | - | - | 16.00°C/W | - | ||
|
|
|
Apex Microtechnology |
31
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK SMT
|
Top Mount | Copper | 0.500" (12.70mm) | 1.220" (30.99mm) | SMD Pad | SMD | 16.00°C/W @ 600 LFM | 50.00°C/W | Solderable |
