- Package Cooled：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Package Cooled | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Package Cooled | Thermal Resistance @ Forced Air Flow | |
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|
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Apex Microtechnology |
48
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 8P TO-3 1.7C/W
|
TO-3 | 1.00°C/W @ 200 LFM | ||
|
|
|
Apex Microtechnology |
4
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 10P DIP
|
10-PowerDip | 0.60°C/W @ 600 LFM |
