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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 3.6W ALUMINUM
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Aluminum | 0.279" (7.10mm) | 0.787" (20.00mm) | - | TO-220 | 1.000" (25.40mm) | 3.6W @ 75°C | 7.45°C/W @ 200 LFM | 20.83°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK TO-220 4.4W ALUMINUM
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Aluminum | 0.375" (9.53mm) | 0.985" (25.00mm) | Clip and Board Mounts | TO-220 | 0.961" (24.40mm) | 4.4W @ 75°C | 4.51°C/W @ 200 LFM | 17.05°C/W | Black Anodized | ||
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-252, 8 X
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Copper | 0.315" (8.00mm) | 0.900" (22.86mm) | - | TO-252 (DPAK) | 0.400" (10.16mm) | 2.1W @ 75°C | 10.05°C/W @ 200 LFM | 35.71°C/W | Tin | ||
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CUI Inc. |
Inquiry
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MOQ: 1 MPQ: 1
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HEAT SINK, STAMPING, TO-263, 14.
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Copper | 0.590" (14.99mm) | 1.020" (25.91mm) | - | TO-263 (D2Pak) | 0.375" (9.52mm) | 2.1W @ 75°C | 8.15°C/W @ 200 LFM | 35.71°C/W | Tin |
