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Discover 71 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products |
3,997
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3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE .91"SQ
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BDN | Aluminum | Square, Pin Fins | 0.910" (23.11mm) | 0.910" (23.11mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | Black Anodized | ||
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CTS Thermal Management Products |
2,354
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.11"SQ
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BDN | Aluminum | Square, Pin Fins | 1.110" (28.19mm) | 1.110" (28.19mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 7.20°C/W @ 400 LFM | 20.90°C/W | Black Anodized | ||
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CTS Thermal Management Products |
1,686
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
|
APF | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
4,900
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||
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|
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CTS Thermal Management Products |
3,861
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | Black Anodized | ||
|
|
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CTS Thermal Management Products |
1,900
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
3,956
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
475
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Aluminum | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 4.40°C/W @ 200 LFM | - | Black Anodized | ||
|
|
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CTS Thermal Management Products |
199
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
969
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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|
|
CTS Thermal Management Products |
657
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Aluminum | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 3.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
1,776
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.41"SQ
|
BDN | Aluminum | Square, Pin Fins | 1.410" (35.81mm) | 1.410" (35.81mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 5.60°C/W @ 400 LFM | 16.20°C/W | Black Anodized | ||
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|
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CTS Thermal Management Products |
192
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
BDN | Aluminum | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 6.80°C/W @ 400 LFM | 19.60°C/W | Black Anodized | ||
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|
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CTS Thermal Management Products |
661
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.21"SQ
|
BDN | Aluminum | Square, Pin Fins | 1.210" (30.73mm) | 1.210" (30.73mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.555" (14.10mm) | - | 5.20°C/W @ 400 LFM | 16.50°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
652
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.31"SQ
|
BDN | Aluminum | Square, Pin Fins | 1.310" (33.27mm) | 1.310" (33.27mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 6.00°C/W @ 400 LFM | 16.10°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
377
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.81"SQ
|
BDN | Aluminum | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.605" (15.37mm) | - | 2.80°C/W @ 400 LFM | 8.10°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
979
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.81"SQ
|
BDN | Aluminum | Square, Pin Fins | 1.810" (45.97mm) | 1.810" (45.97mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.50°C/W @ 400 LFM | 10.80°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
546
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.61"SQ
|
BDN | Aluminum | Square, Pin Fins | 1.610" (40.89mm) | 1.610" (40.89mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 4.50°C/W @ 400 LFM | 13.50°C/W | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
371
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Aluminum | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized | ||
|
|
|
CTS Thermal Management Products |
360
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/THERMAL TAPE
|
APR | Aluminum | Square, Pin Fins | 1.047" (26.60mm) | 1.047" (26.60mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.457" (11.60mm) | - | 5.30°C/W @ 200 LFM | - | Black Anodized |
