- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Selected conditions:
Discover 2 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 22.9X8X10.2MM
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0.315" (8.00mm) | 0.900" (22.86mm) | TO-252 (DPAK) | 0.400" (10.16mm) | 2.5W @ 35°C | 17.50°C/W @ 300 LFM | ||
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Comair Rotron |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK STAMP 26.2X12.7X9.9MM
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0.500" (12.70mm) | 1.031" (26.20mm) | TO-263 (D2Pak) | 0.390" (9.91mm) | 1.3W @ 30°C | 10.00°C/W @ 200 LFM |
