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Discover 149 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Shape | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Wakefield-Vette |
17,584
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/DBL TAPE
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624 | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 25.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
5,813
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/ADH BLK
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624 | Aluminum | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
2,632
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
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655 | Aluminum | Square, Pin Fins | 1.600" (40.64mm) | 1.600" (40.64mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | Black Anodized | ||
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Wakefield-Vette |
4,845
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Aluminum | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 12.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
5,350
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Adhesive | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
5,941
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | - | Black Anodized | ||
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Wakefield-Vette |
2,805
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
2,779
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.600" (15.24mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
7,117
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 27.9MM SQ W/ADH BLK
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658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,155
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 40X40X23MM PIN
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910 | Aluminum | Square, Pin Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip | BGA | 0.892" (22.65mm) | - | 2.00°C/W @ 200 LFM | 8.30°C/W | Black Anodized | ||
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Wakefield-Vette |
1,381
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 5.5X1.5X5" SSR/IGBT
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394 | Aluminum | Rectangular, Fins | 5.500" (139.70mm) | 5.000" (127.00mm) | Bolt On | Power Modules | 1.500" (38.10mm) | - | 0.60°C/W @ 500 LFM | 1.50°C/W | Black Anodized | ||
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Wakefield-Vette |
113
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Aluminum | Rectangular, Fins | 6.000" (152.40mm) | 7.380" (187.45mm) | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.38°C/W | - | ||
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Wakefield-Vette |
39
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Aluminum | Rectangular, Fins | 14.000" (355.60mm) | 7.380" (187.45mm) | Adhesive | Power Modules | 3.136" (79.65mm) | - | - | 0.21°C/W | - | ||
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Wakefield-Vette |
338
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK EXTRUSION IGBT/SSR BLK
|
392 | Aluminum | Rectangular, Fins | 7.087" (180.01mm) | 4.921" (124.99mm) | Press Fit | Power Modules | 5.346" (135.79mm) | - | 0.10°C/W @ 100 LFM | 0.43°C/W | Black Anodized | ||
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Wakefield-Vette |
30
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR PWR MOD/IGBT/RELAY
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510 | Aluminum | Rectangular, Fins | 14.000" (355.60mm) | 7.380" (187.45mm) | Adhesive | Power Modules | 3.106" (78.89mm) | - | - | 0.21°C/W | - | ||
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Wakefield-Vette |
3,457
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK
|
658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | Black Anodized | ||
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Wakefield-Vette |
3,025
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQBLK W/O TAPE
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658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | - | Black Anodized | ||
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Wakefield-Vette |
1,176
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU 28MM SQBLK W/O TAPE
|
658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | Black Anodized | ||
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Wakefield-Vette |
4,555
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 14-16PIN DIP BLK
|
651 | Aluminum | Rectangular, Fins | 0.750" (19.05mm) | 0.415" (10.54mm) | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.240" (6.10mm) | 0.5W @ 40°C | 40.00°C/W @ 300 LFM | - | Black Anodized | ||
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Wakefield-Vette |
4,276
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/OTAPE
|
658 | Aluminum | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | Thermal Tape, Adhesive (Not Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | Black Anodized |
