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Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Material | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products |
2,818
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK PRESS ON .25"H BLK TO-5
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7 | Aluminum | 0.700" (17.78mm) | 0.325" (8.26mm) | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | - | 58.00°C/W | Black Anodized | ||
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Aavid, Thermal Division of Boyd Corporation |
11
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3 days |
-
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MOQ: 1 MPQ: 1
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68855 EXTRUSION 0.46X7.201"X4
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- | Aluminum | 48.000" (1219.20mm) | 7.200" (182.88mm) | Adhesive | - | 0.460" (11.68mm) | - | 0.50°C/W @ 500 LFM | - | - | ||
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Aavid, Thermal Division of Boyd Corporation |
10
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3 days |
-
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MOQ: 1 MPQ: 1
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60340 EXTRUSION 1.312X6.437"X4
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- | Aluminum | 48.000" (1219.20mm) | - | Adhesive | - | 1.312" (33.32mm) | - | - | - | - | |||
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Wakefield-Vette |
Inquiry
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MOQ: 1 MPQ: 1
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HEATSINK DPAK SMT TIN PLATED
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217 | Copper | 0.740" (18.80mm) | 0.600" (15.24mm) | SMD Pad | D2Pak (TO-263), SOL-20, SOT-223, TO-220 | 0.360" (9.14mm) | 1.0W @ 55°C | 16.00°C/W @ 200 LFM | 55.00°C/W | Tin |
