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Discover 5,686 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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CTS Thermal Management Products |
4,900
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 4.00°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
3,956
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
368
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 1.181" (30.00mm) | 1.181" (30.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 2.50°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
2,815
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
|
APF | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | - | 1.90°C/W @ 200 LFM | - | Black Anodized | ||
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CTS Thermal Management Products |
953
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK PRESS ON .50"H BLK TO-5
|
7 | Cylindrical | - | - | 0.440" (11.18mm) OD | Press Fit | TO-5 | 2.0W @ 60°C | - | 34.00°C/W | Black Anodized | ||
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Wakefield-Vette |
350
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR POWERPC CPU BLK
|
609 | Rectangular, Pin Fins | 2.895" (73.53mm) | 2.000" (50.80mm) | - | Clip, Thermal Material | Assorted (BGA, LGA, CPU, ASIC...) | - | 2.50°C/W @ 250 LFM | - | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
170
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12.7MM XCUT T766
|
pushPIN | Square, Fins | 1.969" (50.00mm) | 1.969" (50.00mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 15.86°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
114
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 60X60X12.7MM XCUT T766
|
pushPIN | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 13.83°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
102
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 60X60X12.7MM XCUT T766
|
pushPIN | Square, Fins | 2.362" (60.00mm) | 2.362" (60.00mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 26.30°C/W @ 100 LFM | - | Blue Anodized | |||
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TE Connectivity Raychem Cable Protection |
209
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK
|
- | Rectangular, Pin Fins | - | - | - | Adhesive | - | - | - | - | Black Anodized | |||
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Advanced Thermal Solutions Inc. |
74
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12.7MM XCUT FP
|
pushPIN | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 18.32°C/W @ 100 LFM | - | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
50
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 45X45X12.7MM XCUT FP
|
pushPIN | Square, Fins | 1.772" (45.00mm) | 1.772" (45.00mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 17.00°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12.7MM XCUT T766
|
pushPIN | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 18.32°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
93
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12.7MM XCUT SFP
|
pushPIN | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 25.23°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
91
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 45X45X12.7MM XCUT SFP
|
pushPIN | Rectangular, Fins | 1.772" (45.00mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 26.60°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
96
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X50X12.7MM XCUT SFP
|
pushPIN | Rectangular, Fins | 1.969" (50.00mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 27.03°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12.7MM XCUT T766
|
pushPIN | Square, Fins | 1.575" (40.01mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 18.32°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
99
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 54X54X12.7MM XCUT SFP
|
pushPIN | Rectangular, Fins | 2.126" (54.01mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 26.99°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
86
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X40X12.7MM XCUT T766
|
pushPIN | Rectangular, Fins | 1.969" (50.00mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 27.03°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
98
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 50X40X12.7MM XCUT T766
|
pushPIN | Rectangular, Fins | 1.969" (50.00mm) | 1.575" (40.01mm) | - | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | - | 27.03°C/W @ 100 LFM | - | Blue Anodized |
