- Width：
-
- Attachment Method：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Thermal Resistance @ Natural：
-
Discover 2 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Shape | Length | Width | Attachment Method | Package Cooled | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|
Advanced Thermal Solutions Inc. |
166
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 56MM X 56MM X 31MM
|
Square, Angled Fins | 2.205" (56.00mm) | 2.205" (56.00mm) | Push Pin | LGA | - | 1.00°C/W @ 200 LFM | - | |||
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
Rectangular, Fins | 0.602" (15.29mm) | - | Press Fit | TO-92 | 0.5W @ 20°C | 20.00°C/W @ 200 LFM | 40.00°C/W |
