- Diameter:
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- Attachment Method:
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- Package Cooled:
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- Height Off Base (Height of Fin):
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- Thermal Resistance @ Forced Air Flow:
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- Thermal Resistance @ Natural:
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- Selected conditions:
Discover 2 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | ||
Aavid, Thermal Division of Boyd Corporation |
24,857
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 24-PIN DIP GLUE-ON BLK
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1.250" (31.75mm) | 0.530" (13.46mm) | - | Thermal Tape, Adhesive (Not Included) | 24-DIP | 0.190" (4.83mm) | 15.00°C/W @ 500 LFM | 34.00°C/W | ||||
Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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0.406" (10.31mm) | 0.830" (21.08mm) | 0.316" (8.03mm) ID | Press Fit | TO-5 | 0.395" (10.03mm) | 35.00°C/W @ 200 LFM | 40.00°C/W |