Attachment Method:
Package Cooled:
Height Off Base (Height of Fin):
Power Dissipation @ Temperature Rise:
Thermal Resistance @ Natural:
Material Finish:
Discover 5 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Material Shape Length Width Diameter Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Natural Material Finish
573400D00010G
Aavid, Thermal Division of Boyd Corporation
3,250
3 days
-
MOQ: 1  MPQ: 1
HEATSINK D-PAK3 TIN PLATED SMD
Copper Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - SMD Pad D3Pak 0.401" (10.20mm) 1.0W @ 20°C 14.00°C/W Tin
573400D00010G
Aavid, Thermal Division of Boyd Corporation
3,255
3 days
-
MOQ: 1  MPQ: 1
HEATSINK D-PAK3 TIN PLATED SMD
Copper Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - SMD Pad D3Pak 0.401" (10.20mm) 1.0W @ 20°C 14.00°C/W Tin
573400D00010G
Aavid, Thermal Division of Boyd Corporation
3,255
3 days
-
MOQ: 1  MPQ: 1
HEATSINK D-PAK3 TIN PLATED SMD
Copper Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - SMD Pad D3Pak 0.401" (10.20mm) 1.0W @ 20°C 14.00°C/W Tin
579103B00000G
Aavid, Thermal Division of Boyd Corporation
8,223
3 days
-
MOQ: 1  MPQ: 1
HEATSINK TO-3 BLACK .87"
Aluminum Rhombus 1.540" (39.12mm) - 1.125" (28.57mm) OD Bolt On TO-3 0.870" (22.10mm) 2.5W @ 40°C 12.50°C/W Black Anodized
573400D00000G
Aavid, Thermal Division of Boyd Corporation
Inquiry
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINK
- Rectangular, Fins 0.500" (12.70mm) 1.220" (30.99mm) - SMD Pad D3Pak 0.401" (10.20mm) 1.0W @ 20°C 14.00°C/W Tin