- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Thermal Resistance @ Forced Air Flow：
-
- Selected conditions:
Discover 2 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | |
|
|
|
Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BGA HEAT SINK
|
- | 0.985" (25.02mm) | 0.985" (25.02mm) | Thermal Tape, Adhesive (Included) | 0.390" (9.91mm) | 5.30°C/W @ 200 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 40X40X12MM ELLIPTICAL
|
910 | 1.575" (40.01mm) | 1.575" (40.01mm) | Clip | 0.457" (11.60mm) | 3.10°C/W @ 200 LFM |
