Discover 4 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Material Shape Length Width Attachment Method Package Cooled Height Off Base (Height of Fin) Power Dissipation @ Temperature Rise Thermal Resistance @ Forced Air Flow Material Finish
217-36CTE6
Wakefield-Vette
927
3 days
-
MOQ: 1  MPQ: 1
HEATSINK DPAK SMT TIN PLATED
217 Copper Rectangular, Fins 0.740" (18.80mm) 0.600" (15.24mm) SMD Pad D2Pak (TO-263), SOL-20, SOT-223, TO-220 0.360" (9.14mm) 1.0W @ 55°C 16.00°C/W @ 200 LFM Tin
ATS-EXL66-300-R0
Advanced Thermal Solutions Inc.
92
3 days
-
MOQ: 1  MPQ: 1
HEATSINK AL6063 300X25.4X4MM
- Aluminum Rectangular, Fins 11.800" (299.72mm) 1.000" (25.40mm) Adhesive - 0.157" (4.00mm) - 24.80°C/W @ 200 LFM Degreased
217-36CTRE6
Wakefield-Vette
Inquiry
-
-
MOQ: 1  MPQ: 1
BOARD LEVEL HEAT SINKS
217 Copper Rectangular, Fins 0.740" (18.80mm) 0.600" (15.24mm) SMD Pad D2Pak (TO-263), SOL-20, SOT-223, TO-220 0.360" (9.14mm) 1.0W @ 55°C 16.00°C/W @ 200 LFM Tin
217-36CT6
Wakefield-Vette
Inquiry
-
-
MOQ: 1  MPQ: 1
HEATSINK DPAK SMT TIN PLATED
217 Copper Rectangular 0.740" (18.80mm) 0.600" (15.24mm) SMD Pad D2Pak (TO-263), SOL-20, SOT-223, TO-220 0.360" (9.14mm) 1.0W @ 55°C 16.00°C/W @ 200 LFM Tin