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Discover 667 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Length | Width | Diameter | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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ASSMANN WSW Components |
6,712
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ALUM ANOD
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- | Rectangular, Fins | 0.334" (8.50mm) | 0.250" (6.35mm) | - | Press Fit | 6-Dip and 8-Dip | 0.189" (4.80mm) | - | - | 80.00°C/W | ||
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ASSMANN WSW Components |
25,551
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK ANOD ALUM CPU
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- | Square, Pin Fins | 0.393" (10.00mm) | 0.393" (10.00mm) | - | - | Assorted (BGA, LGA, CPU, ASIC...) | 0.275" (7.00mm) | - | - | 31.00°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
18,047
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 14-16 DIP BLACK .19"
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- | Rectangular, Fins | 0.250" (6.35mm) | 0.731" (18.57mm) | - | Thermal Tape, Adhesive (Not Included) | 14-DIP and 16-DIP | 0.190" (4.83mm) | 0.4W @ 30°C | 50.00°C/W @ 200 LFM | 68.00°C/W | ||
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Wakefield-Vette |
17,584
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/DBL TAPE
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624 | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 25.00°C/W @ 200 LFM | - | ||
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Wakefield-Vette |
5,813
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 21MM SQ W/ADH BLK
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624 | Square, Pin Fins | 0.827" (21.00mm) | 0.827" (21.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | - | 15.00°C/W @ 200 LFM | - | ||
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Wakefield-Vette |
2,632
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 40.6MM SQ H=.525"
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655 | Square, Pin Fins | 1.600" (40.64mm) | 1.600" (40.64mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.522" (13.27mm) | 4.0W @ 40°C | 2.00°C/W @ 400 LFM | - | ||
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Aavid, Thermal Division of Boyd Corporation |
2,876
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK TO-5 1.25W H=.25" BLK
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- | Cylindrical | - | - | 0.315" (8.00mm) ID, 0.750" (19.05mm) OD | Press Fit | TO-5 | 0.250" (6.35mm) | 1.0W @ 60°C | 25.00°C/W @ 200 LFM | 54.00°C/W | ||
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Ohmite |
9,471
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FOR TO-263 BLACK
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D | Rectangular, Fins | 0.500" (12.70mm) | 1.020" (25.91mm) | - | Solderable Feet | TO-263 (D2Pak) | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
4,845
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 25MM SQ W/DBL TAPE
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625 | Square, Pin Fins | 0.984" (25.00mm) | 0.984" (25.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.250" (6.35mm) | - | 12.00°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
5,350
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Adhesive | BGA | 0.250" (6.35mm) | 2.0W @ 40°C | 5.00°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
5,941
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.350" (8.89mm) | - | 3.00°C/W @ 800 LFM | - | ||
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Wakefield-Vette |
2,805
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.450" (11.43mm) | 3.0W @ 50°C | 6.00°C/W @ 200 LFM | - | ||
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CTS Thermal Management Products |
3,997
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE .91"SQ
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BDN | Square, Pin Fins | 0.910" (23.11mm) | 0.910" (23.11mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 9.60°C/W @ 400 LFM | 26.90°C/W | ||
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Wakefield-Vette |
2,779
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 28MM SQ BLK W/TAPE
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658 | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.600" (15.24mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | ||
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Wakefield-Vette |
7,117
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU 27.9MM SQ W/ADH BLK
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658 | Square, Pin Fins | 1.100" (27.94mm) | 1.100" (27.94mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.598" (15.20mm) | 2.5W @ 30°C | 2.00°C/W @ 500 LFM | - | ||
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CTS Thermal Management Products |
2,354
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.11"SQ
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BDN | Square, Pin Fins | 1.110" (28.19mm) | 1.110" (28.19mm) | - | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 7.20°C/W @ 400 LFM | 20.90°C/W | ||
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Advanced Thermal Solutions Inc. |
4,769
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 19MM X 19MM X 9MM
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maxiFLOW | Square, Angled Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | - | 5.30°C/W @ 200 LFM | - | |||
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CTS Thermal Management Products |
1,686
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK LOW-PROFILE FORGED
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APF | Square, Fins | 0.748" (19.00mm) | 0.748" (19.00mm) | - | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | - | 7.10°C/W @ 200 LFM | - | ||
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Advanced Thermal Solutions Inc. |
2,973
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3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 15MM X 15MM X 9.5MM
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- | Square, Fins | 0.590" (14.99mm) | 0.590" (14.99mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 26.20°C/W @ 200 LFM | - | |||
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Advanced Thermal Solutions Inc. |
860
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEAT SINK 17MM X 17MM X 9.5MM
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- | Square, Fins | 0.669" (17.00mm) | 0.669" (17.00mm) | - | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | - | 24.30°C/W @ 200 LFM | - |
