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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 39 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Length | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Advanced Thermal Solutions Inc. |
118
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 288X188X16.5MM
|
- | 7.402" (188.00mm) | 7.402" (188.00mm) | Adhesive | - | 0.650" (16.51mm) | - | 0.60°C/W @ 600 LFM | 4.00°C/W | |||
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Advanced Thermal Solutions Inc. |
111
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X93.4X40MM
|
- | 11.800" (299.72mm) | 3.678" (93.40mm) | Adhesive | - | 1.575" (40.00mm) | - | 0.51°C/W @ 200 LFM | 5.20°C/W | ||
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|
|
Ohmite |
1,400
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268
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D | 0.500" (12.70mm) | 1.580" (40.13mm) | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | ||
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Ohmite |
1,452
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268
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D | 0.500" (12.70mm) | 1.580" (40.13mm) | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | ||
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|
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Ohmite |
1,452
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-268
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D | 0.500" (12.70mm) | 1.580" (40.13mm) | Solderable Feet | TO-268 | 0.460" (11.68mm) | 7.0W @ 35°C | 4.00°C/W @ 700 LFM | - | ||
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|
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Ohmite |
3,336
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
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D | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 0.400" (10.16mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | ||
|
|
|
Ohmite |
1,400
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | ||
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|
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Ohmite |
1,511
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | ||
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|
|
Ohmite |
1,511
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-263
|
D | 0.500" (12.70mm) | 1.020" (25.91mm) | Solderable Feet | TO-263 (D2Pak) | 0.480" (12.19mm) | 2.0W @ 30°C | 8.00°C/W @ 500 LFM | - | ||
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|
|
Ohmite |
159
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FOR TO-247 TO-264
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M | 2.170" (55.12mm) | 1.350" (34.30mm) | Clip and PC Pin | TO-247, TO-264 | 1.520" (38.61mm) | 16.0W @ 43°C | 2.00°C/W @ 400 LFM | - | ||
|
|
Advanced Thermal Solutions Inc. |
55
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 254X100X27MM
|
- | 10.000" (254.00mm) | 3.937" (100.00mm) | Adhesive | - | 1.063" (27.00mm) | - | 0.65°C/W @ 200 LFM | 7.90°C/W | |||
|
|
Advanced Thermal Solutions Inc. |
66
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X80X30MM
|
- | 11.800" (299.72mm) | 3.150" (80.00mm) | Adhesive | - | 1.181" (30.00mm) | - | 0.40°C/W @ 800 LFM | 10.70°C/W | |||
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|
|
Advanced Thermal Solutions Inc. |
44
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X6X8MM
|
- | 11.800" (299.72mm) | 0.236" (6.00mm) | Adhesive | - | 0.315" (8.00mm) | - | 45.00°C/W @ 200 LFM | 65.00°C/W | ||
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|
|
Advanced Thermal Solutions Inc. |
34
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X15X6MM
|
- | 11.800" (299.72mm) | 0.591" (15.00mm) | Adhesive | - | 0.236" (6.00mm) | - | 29.00°C/W @ 200 LFM | 57.00°C/W | ||
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|
|
Advanced Thermal Solutions Inc. |
54
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X14X16MM
|
- | 11.800" (299.72mm) | 0.550" (14.00mm) | Adhesive | - | 0.630" (16.00mm) | - | 11.00°C/W @ 200 LFM | 38.00°C/W | ||
|
|
|
Advanced Thermal Solutions Inc. |
60
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X37X8MM
|
- | 11.800" (299.72mm) | 1.457" (37.00mm) | Adhesive | - | 0.315" (8.00mm) | - | 9.50°C/W @ 200 LFM | 36.40°C/W | ||
|
|
|
Advanced Thermal Solutions Inc. |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X25X35MM
|
- | 11.800" (299.72mm) | 0.984" (25.00mm) | Adhesive | - | 1.378" (35.00mm) | - | 2.50°C/W @ 200 LFM | 13.00°C/W | ||
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|
|
Advanced Thermal Solutions Inc. |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X45X10MM
|
- | 11.800" (299.72mm) | 1.772" (45.00mm) | Adhesive | - | 0.394" (10.00mm) | - | 6.80°C/W @ 200 LFM | 18.60°C/W | ||
|
|
|
Advanced Thermal Solutions Inc. |
76
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X25X22MM
|
- | 11.800" (299.72mm) | 0.984" (25.00mm) | Adhesive | - | 0.866" (22.00mm) | - | 3.90°C/W @ 200 LFM | 18.50°C/W | ||
|
|
|
Advanced Thermal Solutions Inc. |
81
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK AL6063 300X35X25MM
|
- | 11.800" (299.72mm) | 2.010" (51.00mm) | Adhesive | - | 0.984" (25.00mm) | - | 3.00°C/W @ 200 LFM | 9.60°C/W |
