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- Series：
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- Shape：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Thermal Resistance @ Forced Air Flow：
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- Material Finish：
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Discover 12,435 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Thermal Resistance @ Forced Air Flow | Material Finish | |
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CTS Thermal Management Products |
3,956
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 2.50°C/W @ 200 LFM | Black Anodized | ||
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CTS Thermal Management Products |
475
|
3 days |
-
|
MOQ: 1 MPQ: 1
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HEATSINK FORGED W/ADHESIVE TAPE
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APF | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | 4.40°C/W @ 200 LFM | Black Anodized | ||
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|
|
CTS Thermal Management Products |
1,356
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK FORGED W/ADHESIVE TAPE
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APF | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | 3.30°C/W @ 200 LFM | Black Anodized | ||
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CTS Thermal Management Products |
368
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.500" (12.70mm) | 2.50°C/W @ 200 LFM | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
195
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 30X30X10MM R-TAB FP
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pushPIN | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.394" (10.00mm) | 26.36°C/W @ 100 LFM | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
167
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 30X30X15MM R-TAB CP
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pushPIN | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.590" (15.00mm) | 10.07°C/W @ 100 LFM | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
151
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 30X30X25MM L-TAB CP
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pushPIN | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.984" (25.00mm) | 5.52°C/W @ 100 LFM | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
186
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK 30X30X30MM R-TAB CP
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pushPIN | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.181" (30.00mm) | 4.72°C/W @ 100 LFM | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
248
|
3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK 30X30X30MM L-TAB FP
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pushPIN | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 1.181" (30.00mm) | 8.57°C/W @ 100 LFM | Blue Anodized | |||
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Advanced Thermal Solutions Inc. |
1,239
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 9.5MM
|
- | Square, Pin Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.374" (9.50mm) | 14.00°C/W @ 200 LFM | Black Anodized | |||
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|
|
CTS Thermal Management Products |
168
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.250" (6.35mm) | 4.40°C/W @ 200 LFM | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
115
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 24.5MM
|
- | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.964" (24.50mm) | 3.70°C/W @ 200 LFM | Black Anodized | |||
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|
Advanced Thermal Solutions Inc. |
121
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 30X30X20MM L-TAB FP
|
pushPIN | Square, Fins | 1.181" (30.00mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.790" (20.00mm) | 14.03°C/W @ 100 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
206
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 14.5MM
|
- | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.571" (14.50mm) | 6.90°C/W @ 200 LFM | Black Anodized | |||
|
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Advanced Thermal Solutions Inc. |
372
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 9MM
|
maxiFLOW | Square, Angled Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | ASIC | 0.354" (9.00mm) | 4.00°C/W @ 200 LFM | Black Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
636
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 12.5MM
|
maxiFLOW | Square, Angled Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.492" (12.50mm) | 4.40°C/W @ 200 LFM | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
862
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 17.5MM
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maxiFLOW | Square, Angled Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Included) | BGA | 0.689" (17.50mm) | 3.40°C/W @ 200 LFM | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
169
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEAT SINK 30MM X 30MM X 17.5MM
|
maxiGRIP, maxiFLOW | Square, Angled Fins | 1.181" (30.00mm) | Clip, Thermal Material | BGA | 0.689" (17.50mm) | 3.40°C/W @ 200 LFM | Blue Anodized | |||
|
|
|
CTS Thermal Management Products |
80
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK LOW-PROFILE FORGED
|
APF | Square, Fins | 1.181" (30.00mm) | Thermal Tape, Adhesive (Not Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.370" (9.40mm) | 3.30°C/W @ 200 LFM | Black Anodized | ||
|
|
|
ASSMANN WSW Components |
295
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK ALUM ANOD
|
- | Rectangular, Fins | 1.260" (32.00mm) | Bolt On | TO-220 | 0.551" (14.00mm) | - | Black Anodized |
