- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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- Selected conditions:
Discover 4 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Shape | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | |
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CTS Thermal Management Products |
377
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3 days |
-
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MOQ: 1 MPQ: 1
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HEATSINK CPU W/ADHESIVE 1.81"SQ
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BDN | Square, Pin Fins | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.605" (15.37mm) | - | 2.80°C/W @ 400 LFM | 8.10°C/W | ||
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CTS Thermal Management Products |
979
|
3 days |
-
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MOQ: 1 MPQ: 1
|
HEATSINK CPU W/ADHESIVE 1.81"SQ
|
BDN | Square, Pin Fins | Thermal Tape, Adhesive (Included) | Assorted (BGA, LGA, CPU, ASIC...) | 0.355" (9.02mm) | - | 3.50°C/W @ 400 LFM | 10.80°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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-
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MOQ: 1 MPQ: 1
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BOARD LEVEL HEAT SINK
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- | Rectangular, Pin Fins | Bolt On | TO-3 | 0.750" (19.05mm) | 5.0W @ 40°C | 1.50°C/W @ 200 LFM | 6.70°C/W | ||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
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- | Rectangular, Pin Fins | Bolt On | TO-3 | 1.500" (38.10mm) | 5.0W @ 30°C | 2.00°C/W @ 300 LFM | 4.70°C/W |
