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- Series：
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- Attachment Method：
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- Package Cooled：
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- Height Off Base (Height of Fin)：
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- Power Dissipation @ Temperature Rise：
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- Thermal Resistance @ Forced Air Flow：
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- Thermal Resistance @ Natural：
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Discover 2,065 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Width | Attachment Method | Package Cooled | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | Thermal Resistance @ Natural | Material Finish | |
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Advanced Thermal Solutions Inc. |
27
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM FP
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
89
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM FP
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.12°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
63
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM FP
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
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Advanced Thermal Solutions Inc. |
88
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
90
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
97
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
86
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
94
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.82°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.12°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.48°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.12°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
100
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.12°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
95
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X22.86MM T766
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.900" (22.86mm) | - | 6.42°C/W @ 100 LFM | - | Blue Anodized | |||
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Aavid, Thermal Division of Boyd Corporation |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
BOARD LEVEL HEAT SINK
|
- | 0.530" (13.46mm) | Thermal Tape, Adhesive (Not Included) | 28-DIP | 0.190" (4.83mm) | 2.5W @ 80°C | 10.00°C/W @ 700 LFM | 32.00°C/W | Black Anodized | ||
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Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM FP
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.46°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X11.43MM FP
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.450" (11.43mm) | - | 14.81°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X17.78MM FP
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.700" (17.78mm) | - | 9.10°C/W @ 100 LFM | - | Blue Anodized | |||
|
|
Advanced Thermal Solutions Inc. |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK 36.83X57.6X5.84MM FP
|
pushPIN | 2.267" (57.60mm) | Push Pin | Assorted (BGA, LGA, CPU, ASIC...) | 0.230" (5.84mm) | - | 22.55°C/W @ 100 LFM | - | Blue Anodized |
