- Attachment Method：
-
- Height Off Base (Height of Fin)：
-
- Power Dissipation @ Temperature Rise：
-
- Thermal Resistance @ Forced Air Flow：
-
- Selected conditions:
Discover 3 products
 |
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Attachment Method | Height Off Base (Height of Fin) | Power Dissipation @ Temperature Rise | Thermal Resistance @ Forced Air Flow | |
|
|
|
Wakefield-Vette |
4,378
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
Thermal Tape, Adhesive (Not Included) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM | ||
|
|
|
Wakefield-Vette |
562
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.4"
|
Thermal Tape, Adhesive (Not Included) | 0.400" (10.16mm) | 2.5W @ 30°C | 4.00°C/W @ 300 LFM | ||
|
|
|
Wakefield-Vette |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
HEATSINK CPU 43MM SQ BLK H=.65"
|
Thermal Tape, Adhesive (Included) | 0.650" (16.51mm) | 3.0W @ 20°C | 2.00°C/W @ 400 LFM |
