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Discover 142 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Applications | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Program Memory Type | Controller Series | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Applications | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Mounting Type | Core Processor | Number of I/O | RAM Size | Program Memory Type | Controller Series | |
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Microchip Technology |
Inquiry
|
- |
-
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MOQ: 5000 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
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Tape & Reel (TR) | - | Trusted Platform Module (TPM) | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | - | ||
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Microchip Technology |
3,160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
|
Cut Tape (CT) | - | Trusted Platform Module (TPM) | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | - | ||
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Microchip Technology |
3,160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
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- | - | Trusted Platform Module (TPM) | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | - | ||
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NXP USA Inc. |
3,000
|
3 days |
-
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MOQ: 3000 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
Tape & Reel (TR) | A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | MX51 | - | - | - | - | ||
|
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NXP USA Inc. |
3,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
Cut Tape (CT) | A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | MX51 | - | - | - | - | ||
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NXP USA Inc. |
3,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
- | A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 6000 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
Tape & Reel (TR) | A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
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NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
Cut Tape (CT) | A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
- | A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
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NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 3000 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
Tape & Reel (TR) | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | MX51 | - | - | - | - | ||
|
|
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NXP USA Inc. |
3,000
|
3 days |
-
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MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
Cut Tape (CT) | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
- | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 12-UFBGA，WLCSP | 12-WLCSP (2.06x2.02) | Surface Mount | MX51 | - | - | - | - | ||
|
|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURE AUTHENTICATION
|
Tape & Reel (TR) | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
NXP USA Inc. |
5,732
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
Cut Tape (CT) | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
NXP USA Inc. |
5,732
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
- | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
Tape & Reel (TR) | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
NXP USA Inc. |
5,999
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
Cut Tape (CT) | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
NXP USA Inc. |
5,999
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
- | A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - | ||
|
|
|
Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
PRODFF COM I2C TPM 4X4 32VQFN
|
Tray | - | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | Surface Mount | AVR | 4 | - | - | - | ||
|
|
|
NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 6000 MPQ: 1
|
SECURE AUTHENTICATION
|
Tape & Reel (TR) | A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | Surface Mount | MX51 | - | - | - | - |
