Discover 22 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Series Applications Voltage - Supply Operating Temperature Package / Case Supplier Device Package Core Processor Number of I/O
AT97SC3205T-H3M46-00
Microchip Technology
3,160
3 days
-
MOQ: 1  MPQ: 1
FF IND I2C TPM 4X4 32VQFN CEK
- Trusted Platform Module (TPM) 3.3V -40°C ~ 85°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
A7101CHUK/T0BC2HAZ
NXP USA Inc.
3,000
3 days
-
MOQ: 1  MPQ: 1
SECURITY IC STD TEMP WLCSP
A71CH Authentication 2.5 V ~ 3.6 V -25°C ~ 85°C (TA) 12-UFBGA,WLCSP 12-WLCSP (2.06x2.02) MX51 -
A7101CHTK2/T0BC2BJ
NXP USA Inc.
6,000
3 days
-
MOQ: 1  MPQ: 1
SECURITY IC STD TEMP HVSON8
A71CH Authentication 2.5 V ~ 3.6 V -25°C ~ 85°C (TA) 8-VDFN Exposed Pad 8-HVSON (4x4) MX51 -
A7102CHUK/T0BC2VAZ
NXP USA Inc.
3,000
3 days
-
MOQ: 1  MPQ: 1
SECURITY IC EXT TEMP WLCSP
A71CH Authentication 2.5 V ~ 3.6 V -40°C ~ 90°C (TA) 12-UFBGA,WLCSP 12-WLCSP (2.06x2.02) MX51 -
A7102CHTK2/T0BC2AJ
NXP USA Inc.
5,732
3 days
-
MOQ: 1  MPQ: 1
SECURE AUTHENTICATION
A71CH Authentication 2.5 V ~ 3.6 V -40°C ~ 90°C (TA) 8-VDFN Exposed Pad 8-HVSON (4x4) MX51 -
A7102CHTK2/T0BC2CJ
NXP USA Inc.
5,999
3 days
-
MOQ: 1  MPQ: 1
SECURITY IC EXT TEMP HVSON8
A71CH Authentication 2.5 V ~ 3.6 V -40°C ~ 90°C (TA) 8-VDFN Exposed Pad 8-HVSON (4x4) MX51 -
A7101CHTK2/T0BC2VJ
NXP USA Inc.
9
3 days
-
MOQ: 1  MPQ: 1
SECURE AUTHENTICATION
A71CH Authentication 2.5 V ~ 3.6 V -25°C ~ 90°C (TA) 8-VDFN Exposed Pad 8-HVSON (4x4) MX51 -
AT97SC3205T-G3M46-00
Microchip Technology
Inquiry
-
-
MOQ: 1  MPQ: 1
FF COM I2C TPM 4X4 32VQFN CEK
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
AT97SC3205T-H3M4C-10
Microchip Technology
1,000
3 days
-
MOQ: 1  MPQ: 1
FF IND I2C TPM 4X4 32VQFN UEK
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
AT97SC3205T-H3M4C-20
Microchip Technology
1,000
3 days
-
MOQ: 1  MPQ: 1
FF IND I2C TPM 4X4 32VQFN SEK
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
AT97SC3205T-X3A1C-10
Microchip Technology
980
3 days
-
MOQ: 1  MPQ: 1
FF COM I2C TPM 4.4MM TSSOP UEK
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 28-TSSOP (0.173",4.40mm Width) 28-TSSOP AVR 4
AT97SC3205T-X3A1C-20
Microchip Technology
993
3 days
-
MOQ: 1  MPQ: 1
FF COM I2C TPM 4.4MM TSSOP SEK
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 28-TSSOP (0.173",4.40mm Width) 28-TSSOP AVR 4
AT97SC3205T-U3A1C-10
Microchip Technology
916
3 days
-
MOQ: 1  MPQ: 1
FF IND I2C TPM 4.4MM TSSOP UEK
- Trusted Platform Module (TPM) 3.3V -40°C ~ 85°C 28-TSSOP (0.173",4.40mm Width) 28-TSSOP AVR 4
AT97SC3205T-U3A1C-20
Microchip Technology
995
3 days
-
MOQ: 1  MPQ: 1
FF IND I2C TPM 4.4MM TSSOP SEK
- Trusted Platform Module (TPM) 3.3V -40°C ~ 85°C 28-TSSOP (0.173",4.40mm Width) 28-TSSOP AVR 4
AT97SC3205T-G3M4C-00
Microchip Technology
988
3 days
-
MOQ: 1  MPQ: 1
FF COM I2C TPM 4X4 32VQFN CEK
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
AT97SC3205T-G3M4C-20
Microchip Technology
971
3 days
-
MOQ: 1  MPQ: 1
FF COM I2C TPM 4X4 32VQFN SEK
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
AT97SC3205T-H3M4C-00
Microchip Technology
711
3 days
-
MOQ: 1  MPQ: 1
FF IND I2C TPM 4X4 32VQFN CEK
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
AT97SC3205T-G3M4B-10
Microchip Technology
Inquiry
-
-
MOQ: 0  MPQ: 1
PROD STD COM I2C TPM 4X4 32VQFN
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
AT97SC3205T-G3M4B-20
Microchip Technology
Inquiry
-
-
MOQ: 0  MPQ: 1
PROD STD COM I2C TPM 4X4 32VQFN
- Trusted Platform Module (TPM) 3.3V 0°C ~ 70°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4
AT97SC3205T-H3M4B-00
Microchip Technology
Inquiry
-
-
MOQ: 0  MPQ: 1
PROD STD IND I2C TPM 4X4 32VQFN
- Trusted Platform Module (TPM) 3.3V -40°C ~ 85°C 32-VFQFN Exposed Pad 32-VQFN (4x4) AVR 4