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Discover 22 products
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Applications | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | ||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Series | Applications | Voltage - Supply | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | ||
Microchip Technology |
3,160
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
|
- | Trusted Platform Module (TPM) | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP WLCSP
|
A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 12-UFBGA,WLCSP | 12-WLCSP (2.06x2.02) | MX51 | - | ||||
NXP USA Inc. |
6,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC STD TEMP HVSON8
|
A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 85°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | MX51 | - | ||||
NXP USA Inc. |
3,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP WLCSP
|
A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 12-UFBGA,WLCSP | 12-WLCSP (2.06x2.02) | MX51 | - | ||||
NXP USA Inc. |
5,732
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | MX51 | - | ||||
NXP USA Inc. |
5,999
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURITY IC EXT TEMP HVSON8
|
A71CH | Authentication | 2.5 V ~ 3.6 V | -40°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | MX51 | - | ||||
NXP USA Inc. |
9
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
SECURE AUTHENTICATION
|
A71CH | Authentication | 2.5 V ~ 3.6 V | -25°C ~ 90°C (TA) | 8-VDFN Exposed Pad | 8-HVSON (4x4) | MX51 | - | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN CEK
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN UEK
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
Microchip Technology |
1,000
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN SEK
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
Microchip Technology |
980
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4.4MM TSSOP UEK
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | AVR | 4 | ||||
Microchip Technology |
993
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4.4MM TSSOP SEK
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | AVR | 4 | ||||
Microchip Technology |
916
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4.4MM TSSOP UEK
|
- | Trusted Platform Module (TPM) | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | AVR | 4 | ||||
Microchip Technology |
995
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4.4MM TSSOP SEK
|
- | Trusted Platform Module (TPM) | 3.3V | -40°C ~ 85°C | 28-TSSOP (0.173",4.40mm Width) | 28-TSSOP | AVR | 4 | ||||
Microchip Technology |
988
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN CEK
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
Microchip Technology |
971
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF COM I2C TPM 4X4 32VQFN SEK
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
Microchip Technology |
711
|
3 days |
-
|
MOQ: 1 MPQ: 1
|
FF IND I2C TPM 4X4 32VQFN CEK
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 0 MPQ: 1
|
PROD STD COM I2C TPM 4X4 32VQFN
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 0 MPQ: 1
|
PROD STD COM I2C TPM 4X4 32VQFN
|
- | Trusted Platform Module (TPM) | 3.3V | 0°C ~ 70°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 | ||||
Microchip Technology |
Inquiry
|
- |
-
|
MOQ: 0 MPQ: 1
|
PROD STD IND I2C TPM 4X4 32VQFN
|
- | Trusted Platform Module (TPM) | 3.3V | -40°C ~ 85°C | 32-VFQFN Exposed Pad | 32-VQFN (4x4) | AVR | 4 |