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Discover 197 products
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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Image | Part Number | Manufacturer | Quantity | Delivery period | Unit Price | Buy | Description | Packaging | Series | Operating Temperature | Package / Case | Supplier Device Package | Core Processor | Number of I/O | Speed | RAM Size | Program Memory Size | Program Memory Type | EEPROM Size | Voltage - Supply (Vcc/Vdd) | Data Converters | Oscillator Type | Connectivity | Core Size | |
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NXP USA Inc. |
19,054
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3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 8BIT 4.5KB OTP 28SOIC
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Tube | HC05 | -40°C ~ 85°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | HC05 | 21 | 2.1MHz | 176 x 8 | 4.5KB (4.5K x 8) | OTP | - | 3 V ~ 5.5 V | A/D 4x8b | Internal | SIO | 8-Bit | ||
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NXP USA Inc. |
886
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 52PLCC
|
Tube | HC11 | -40°C ~ 85°C (TA) | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | HC11 | 38 | 3MHz | 512 x 8 | - | ROMless | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
1,986
|
3 days |
-
|
MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 68PLCC
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Tube | HC11 | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | HC11 | 30 | 3MHz | 1K x 8 | - | ROMless | 512 x 8 | 4.75 V ~ 5.25 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
423
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3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 68PLCC
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Tube | HC11 | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | HC11 | 30 | 4MHz | 1K x 8 | - | ROMless | 512 x 8 | 4.75 V ~ 5.25 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
900
|
3 days |
-
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MOQ: 1 MPQ: 1
|
IC MCU 16BIT 64KB FLASH 100LQFP
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Tray | 56F8xx | -40°C ~ 85°C (TA) | 100-LQFP | 100-LQFP (14x14) | 56800 | 46 | 80MHz | 4K x 16 | 64KB (32K x 16) | Flash | - | 2.25 V ~ 2.75 V | - | External | EBI/EMI，SCI，SPI，SSI | 16-Bit | ||
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NXP USA Inc. |
721
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 16BIT 4KB EEPROM 112LQFP
|
Tray | HC12 | -40°C ~ 85°C (TA) | 112-LQFP | 112-LQFP (20x20) | CPU12 | 83 | 8MHz | 1K x 8 | 4KB (4K x 8) | EEPROM | - | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
4,669
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 20KB OTP 52PLCC
|
Tube | HC11 | -40°C ~ 85°C (TA) | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | HC11 | 38 | 2MHz | 768 x 8 | 20KB (20K x 8) | OTP | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
411
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 52PLCC
|
Tray | HC11 | -40°C ~ 85°C (TA) | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | HC11 | 38 | 2MHz | 512 x 8 | - | ROMless | - | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
28
|
3 days |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT ROMLESS 68PLCC
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Tube | HC11 | -40°C ~ 85°C (TA) | 68-LCC (J-Lead) | 68-PLCC (25x25) | HC11 | 30 | 2MHz | 1K x 8 | - | ROMless | 512 x 8 | 4.75 V ~ 5.25 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1 MPQ: 1
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IC MCU 8BIT 8KB OTP 44PLCC
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Tube | HC05 | -40°C ~ 85°C (TA) | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | HC05 | 24 | 2.1MHz | 304 x 8 | 8KB (8K x 8) | OTP | - | 3 V ~ 5.5 V | - | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 1250 MPQ: 1
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IC MCU 16BIT 32KB FLASH 48LQFP
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Tray | 56F8xxx | -40°C ~ 105°C (TA) | 48-LQFP | 48-LQFP (7x7) | 56800E | 21 | 40MHz | 4K x 16 | 32KB (16K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 6x12b | Internal | SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 26 MPQ: 1
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IC MCU 8BIT 4.5KB OTP 28SOIC
|
Tube | HC05 | -40°C ~ 125°C (TA) | 28-SOIC (0.295"，7.50mm Width) | 28-SOIC | HC05 | 21 | 2.1MHz | 176 x 8 | 4.5KB (4.5K x 8) | OTP | - | 3 V ~ 5.5 V | A/D 4x8b | Internal | SIO | 8-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 160 MPQ: 1
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IC MCU 16BIT 32KB FLASH 64LQFP
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Tray | 56F8xxx | -40°C ~ 105°C (TA) | 64-LQFP | 64-LQFP (10x10) | 56800E | 27 | 40MHz | 8K x 8 | 32KB (16K x 16) | Flash | - | 2.25 V ~ 3.6 V | A/D 8x12b | Internal | SCI，SPI | 16-Bit | ||
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NXP USA Inc. |
Inquiry
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- |
-
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MOQ: 480 MPQ: 1
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IC MCU 8BIT 8KB OTP 44QFP
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Tray | HC05 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | HC05 | 24 | 2.1MHz | 304 x 8 | 8KB (8K x 8) | OTP | - | 3 V ~ 5.5 V | - | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
IC MCU 8BIT 8KB OTP 44PLCC
|
Tape & Reel (TR) | HC05 | -40°C ~ 85°C (TA) | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | HC05 | 24 | 2.1MHz | 304 x 8 | 8KB (8K x 8) | OTP | - | 3 V ~ 5.5 V | - | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 800 MPQ: 1
|
IC MCU 8BIT ROMLESS 52LQFP
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Tray | HC11 | -40°C ~ 85°C (TA) | 52-LQFP | 52-TQFP (10x10) | HC11 | 38 | 2MHz | 512 x 8 | - | ROMless | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
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MOQ: 450 MPQ: 1
|
IC MCU 8BIT ROMLESS 52PLCC
|
Tape & Reel (TR) | HC11 | -40°C ~ 85°C (TA) | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | HC11 | 38 | 2MHz | 512 x 8 | - | ROMless | - | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 480 MPQ: 1
|
IC MCU 8BIT 8KB OTP 44QFP
|
Tray | HC05 | -40°C ~ 85°C (TA) | 44-QFP | 44-QFP (10x10) | HC05 | 24 | 4MHz | 304 x 8 | 8KB (8K x 8) | OTP | - | 3 V ~ 5.5 V | - | Internal | SCI，SPI | 8-Bit | ||
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|
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 8BIT ROMLESS 52PLCC
|
Tape & Reel (TR) | HC11 | -40°C ~ 85°C (TA) | 52-LCC (J-Lead) | 52-PLCC (19.1x19.1) | HC11 | 38 | 3MHz | 512 x 8 | - | ROMless | 512 x 8 | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit | ||
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NXP USA Inc. |
Inquiry
|
- |
-
|
MOQ: 450 MPQ: 1
|
IC MCU 8BIT ROMLESS 44PLCC
|
Tape & Reel (TR) | HC11 | -40°C ~ 85°C (TA) | 44-LCC (J-Lead) | 44-PLCC (16.59x16.59) | HC11 | 38 | 3MHz | 512 x 8 | - | ROMless | - | 4.5 V ~ 5.5 V | A/D 8x8b | Internal | SCI，SPI | 8-Bit |
