Discover 69 products
Image Part Number Manufacturer Quantity Delivery period Unit Price Buy Description Packaging Series Operating Temperature Package / Case Core Processor Number of I/O Speed RAM Size Program Memory Size EEPROM Size Voltage - Supply (Vcc/Vdd) Data Converters Connectivity
LPC1114FHN33/302:5
NXP USA Inc.
3,714
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray LPC1100L -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 8K x 8 32KB (32K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,SPI,UART/USART
LPC1114FHN33/301,5
NXP USA Inc.
2,330
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray LPC1100 -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 8K x 8 32KB (32K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,SPI,UART/USART
LPC1114FHN33/333,5
NXP USA Inc.
260
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 56KB FLASH 33HVQFN
Tray LPC1100L -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 8K x 8 56KB (56K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,SPI,UART/USART
LPC11U24FHN33/401,
NXP USA Inc.
7,200
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray LPC11Uxx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 26 50MHz 10K x 8 32KB (32K x 8) 4K x 8 1.8 V ~ 3.6 V A/D 8x10b I2C,Microwire,SPI,SSI,SSP,UART/USART,USB
LPC1347FHN33,551
NXP USA Inc.
5,673
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 64KB FLASH 33HVQFN
Tray LPC13xx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M3 26 72MHz 12K x 8 64KB (64K x 8) 4K x 8 2 V ~ 3.6 V A/D 8x12b I2C,Microwire,SPI,SSI,SSP,UART/USART,USB
LPC1111FHN33/1025
NXP USA Inc.
4,000
3 days
-
MOQ: 4000  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
Tape & Reel (TR) LPC1100L -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 2K x 8 8KB (8K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,SPI,UART/USART
LPC1111FHN33/1025
NXP USA Inc.
4,000
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
Cut Tape (CT) LPC1100L -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 2K x 8 8KB (8K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,SPI,UART/USART
LPC1111FHN33/1025
NXP USA Inc.
4,000
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
- LPC1100L -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 2K x 8 8KB (8K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,SPI,UART/USART
LPC11E14FHN33/401,
NXP USA Inc.
485
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray LPC11Exx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 10K x 8 32KB (32K x 8) 4K x 8 1.8 V ~ 3.6 V A/D 8x10b I2C,Microwire,SPI,SSI,SSP,UART/USART
LPC11U14FHI33/201,
NXP USA Inc.
913
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray LPC11Uxx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 26 50MHz 6K x 8 32KB (32K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB
LPC1111FHN33/101,5
NXP USA Inc.
1,324
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
Tray LPC1100 -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 2K x 8 8KB (8K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,SPI,UART/USART
LPC1112FHN33/101,5
NXP USA Inc.
35,445
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 33HVQFN
Tray LPC1100 -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 2K x 8 16KB (16K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,SPI,UART/USART
LPC11E11FHN33/101,
NXP USA Inc.
1,040
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 8KB FLASH 33HVQFN
Tray LPC11Exx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 28 50MHz 4K x 8 8KB (8K x 8) 512 x 8 1.8 V ~ 3.6 V A/D 8x10b I2C,Microwire,SPI,SSI,SSP,UART/USART
LPC11U14FHN33/201,
NXP USA Inc.
721
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray LPC11Uxx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 26 50MHz 6K x 8 32KB (32K x 8) - 1.8 V ~ 3.6 V A/D 8x10b I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB
LPC1313FHN33/01,55
NXP USA Inc.
385
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray LPC13xx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M3 28 72MHz 8K x 8 32KB (32K x 8) - 2 V ~ 3.6 V A/D 8x10b I2C,Microwire,SPI,SSI,UART/USART
LPC1342FHN33,551
NXP USA Inc.
160
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 16KB FLASH 33HVQFN
Tray LPC13xx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M3 28 72MHz 4K x 8 16KB (16K x 8) - 2 V ~ 3.6 V A/D 8x10b I2C,Microwire,SPI,SSI,SSP,UART/USART,USB
LPC1316FHN33,551
NXP USA Inc.
407
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 48KB FLASH 33HVQFN
Tray LPC13xx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M3 26 72MHz 8K x 8 48KB (48K x 8) 4K x 8 2 V ~ 3.6 V A/D 8x12b I2C,Microwire,SPI,SSI,SSP,UART/USART
LPC1317FHN33,551
NXP USA Inc.
591
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 64KB FLASH 33HVQFN
Tray LPC13xx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M3 26 72MHz 10K x 8 64KB (64K x 8) 4K x 8 2 V ~ 3.6 V A/D 8x12b I2C,Microwire,SPI,SSI,SSP,UART/USART
LPC11U34FHN33/311,
NXP USA Inc.
260
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 40KB FLASH 33HVQFN
Tray LPC11Uxx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M0 26 50MHz 8K x 8 40KB (40K x 8) 4K x 8 1.8 V ~ 3.6 V A/D 8x10b I2C,Microwire,SmartCard,SPI,SSP,UART/USART,USB
LPC1343FHN33,551
NXP USA Inc.
234
3 days
-
MOQ: 1  MPQ: 1
IC MCU 32BIT 32KB FLASH 33HVQFN
Tray LPC13xx -40°C ~ 85°C (TA) 32-VQFN Exposed Pad ARM Cortex-M3 28 72MHz 8K x 8 32KB (32K x 8) - 2 V ~ 3.6 V A/D 8x10b I2C,Microwire,SPI,SSI,SSP,UART/USART,USB